Perforated Semiconductor Clip for Delamination Resistance
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Solution Overview
Problem
Semiconductor assemblies face delamination issues due to internal stresses caused by thermal expansion differences between components, which existing technologies fail to adequately address.
Innovation Solution
A clip for semiconductor devices with a high hole density, optimized for improved adhesion and stress absorption through increased solder contact area and volume, and designed to accommodate thermal expansion variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the clip is made from a solid material without holes, then the mechanical strength is high, but the adhesion between clip and isolator is insufficient leading to delamination
Solution Approach 1:
The clip is designed with a plurality of holes creating a porous structure that allows the isolator material to penetrate and form mechanical interlocking. This increases the contact area and adhesion between the clip and isolator while maintaining acceptable mechanical strength through the distributed hole pattern at controlled density (at least 4 holes/mm²).
Solution Approach 2:
The holes in the clip allow the isolator material to nest within the clip structure, creating a interlocked assembly where the isolator enters and occupies the hole spaces, thereby strengthening the bond between components through geometric interlocking rather than relying solely on surface adhesion.
2Reliability
If the hole density is increased to improve adhesion, then the adhesion between clip and isolator improves, but the mechanical strength of the clip decreases
Solution Approach 1:
The patent optimizes the hole density parameter to at least 4 holes/mm², which represents a carefully selected threshold that provides sufficient adhesion improvement while maintaining acceptable mechanical strength. This parameter change balances the competing requirements of adhesion and structural integrity.
Solution Approach 2:
The holes are distributed across the clip surface with specific density requirements, creating local variations in material distribution that optimize adhesion in critical areas while maintaining overall structural strength. The non-uniform or selectively distributed hole pattern allows different regions to serve different functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The high hole density in the clip enhances adhesion and flexibility, reducing the likelihood of delamination and stress-related failures in semiconductor devices under temperature fluctuations.
Implementation Method 1
The plurality of holes also improve adhesion between the clip and the isolator because the isolator enters the holes, providing a greater contact area between the isolator and the clip.
Implementation Method 2
These temperature fluctuations result in the expansion and contraction of the components of the clip. The coefficient of thermal expansion of each component varies, and so the amount by which each component expands and contracts as a result of temperature changes also varies.
Data Source
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AI summary
There is disclosed a clip for a semi-conductor device. The clip is provided with a plurality of holes. The plurality of holes define a hole density of at least 4 holes/mm2.