Semiconductor Clip Package Layout for Compact Reliable Interconnection
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Solution Overview
Problem
Existing semiconductor packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, low performance, and oversized packages.
Innovation Solution
The proposed semiconductor device includes a clip structure connected to an electronic component, with an encapsulant covering the component, clip structure, and component port, providing electrical interconnection and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional semiconductor packaging methods are used, then manufacturing processes are simpler, but package size becomes too large
Solution Approach 1:
The patent segments the semiconductor package into distinct functional regions: a recessed area for the electronic component and elevated areas for electrical interconnection. This segmentation allows the package to maintain electrical connectivity while reducing overall footprint, resolving the contradiction between compact size and manufacturing complexity.
Solution Approach 2:
The patent utilizes vertical dimensionality by creating elevated interconnection areas that rise above the recessed component area. This three-dimensional arrangement allows electrical connections to be made without increasing the planar footprint, effectively reducing package size while maintaining connectivity functionality.
2Reliability
If conventional package designs are used, then manufacturing is easier, but reliability decreases
Solution Approach 1:
The patent incorporates an encapsulant material that fills the recessed area and provides environmental protection to the electronic component before failure can occur. This protective encapsulation enhances reliability by shielding the component from moisture and contaminants during the manufacturing process and throughout the device lifecycle.
Solution Approach 2:
The electronic component is nested within the recessed area of the package, which is then filled and sealed with encapsulant material. This nested structure protects the component while maintaining a compact form factor, improving reliability without significantly complicating the manufacturing process.
3Reliability
If existing packaging structures are used, then cost is lower, but performance is reduced
Solution Approach 1:
The patent applies different material properties to different regions of the package: the recessed area contains the electronic component with specific electrical properties, while the elevated areas provide electrical interconnection with conductive properties. This localized differentiation of material qualities optimizes device performance by placing appropriate materials where needed, rather than using uniform materials throughout.
Solution Approach 2:
The package utilizes composite construction with distinct materials for different functions: conductive materials for elevated interconnection areas, encapsulant materials for environmental protection, and substrate materials for structural support. This composite approach enhances overall device performance by combining the advantages of different materials in their optimal locations.
Data Source
AI summary
In one example, a semiconductor device comprises an electronic component comprising a component face side, a component base side, a component lateral side connecting the component face side to the component base side, and a component port adjacent to the component face side, wherein the component port comprises a component port face. A clip structure comprises a first clip pad, a second clip pad, a first clip leg connecting the first clip pad to the second clip pad, and a first clip face. An encapsulant covers portions of the electronic component and the clip structure. The encapsulant comprises an encapsulant face, the first clip pad is coupled to the electronic component, and the component port face and the first clip face are exposed from the encapsulant face. Other examples and related methods are also disclosed herein.