Semiconductor Clip Three-Point Support for Vibration Resistance
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Solution Overview
Problem
The existing manufacturing process of semiconductor devices, particularly inverter circuits, faces challenges such as damage to semiconductor chips and connection reliability issues due to impact and vibration during conveyance, as well as deformation and positional shifts of clips, leading to reduced manufacturing yield and thermal fatigue resistance.
Innovation Solution
A semiconductor device manufacturing method that includes a three-point support structure for the clip, where the clip is supported by the lead frame and additional hanging parts, ensuring secure positioning and dispersion of weight, thereby enhancing connection reliability and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the chip mounting part and lead frame are connected by only a clip during conveyance, then the manufacturing process can be simplified and productivity improved, but the reliability deteriorates due to damage from impact and vibration
Solution Approach 1:
The support structure is divided into multiple segments: the chip mounting part, the lead frame, and intermediate support parts positioned between them. This segmentation distributes the mechanical stress and provides multiple support points, preventing damage during conveyance while maintaining process efficiency.
Solution Approach 2:
Intermediate support parts are introduced as intermediary elements between the chip mounting part and the lead frame. These support parts act as mediators that distribute loads and prevent direct stress concentration on the clip connections, thereby improving reliability without complicating the manufacturing process.
2Device complexity
If the clip is used to connect the semiconductor chip and lead frame, then the device complexity is reduced, but the strength of connection deteriorates under impact and vibration
Solution Approach 1:
The connection structure is segmented into multiple support points including the chip mounting part, intermediate support parts, and lead frame. This segmentation distributes mechanical stress across multiple locations, enhancing overall connection strength without requiring a complex single-point connection mechanism.
Solution Approach 2:
The intermediate support parts are positioned in advance to provide cushioning and support before impact or vibration occurs during conveyance. This preemptive support structure prevents stress concentration on the clip connections, maintaining connection strength under dynamic conditions.
3Reliability
If additional support parts are added to support the clip, then the reliability improves by reducing damage from impact and vibration, but the device complexity increases
Solution Approach 1:
The intermediate support parts serve multiple functions: they provide mechanical support, distribute stress, and maintain positional stability during conveyance. By making these components multi-functional, the design achieves improved reliability without proportionally increasing overall device complexity.
Solution Approach 2:
The support structure uses homogeneous materials and similar structural elements throughout (chip mounting part, intermediate support parts, and lead frame), which simplifies manufacturing and assembly while providing uniform stress distribution and improved reliability.
4Ease of operation
If the clip is allowed to move freely during conveyance, then the ease of operation improves, but the positional precision deteriorates due to deformation and shifts
Solution Approach 1:
The support structure is segmented into multiple fixed points (chip mounting part, intermediate support parts, and lead frame) that collectively constrain the clip's position. This segmentation provides flexibility for conveyance operations while maintaining precise positioning through distributed support.
Solution Approach 2:
The intermediate support parts act as mediators that maintain the clip's positional precision during conveyance. These support parts provide necessary constraints to prevent deformation and shifts, while still allowing the system to be easily operated and conveyed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the reliability of semiconductor devices by reducing damage from impact and vibration, maintaining connection integrity, and enhancing thermal dissipation and fatigue resistance, leading to increased manufacturing yield and device performance.
Implementation Method 1
arranging a main body part of a metal plate via a conductive adhesive so as to lie astride an electrode pad of a semiconductor chip and a lead
Data Source
AI summary
On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.