Semiconductor Cluster Tool for In-Situ Process Sequence Integration
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Solution Overview
Problem
Current gradient variation techniques in semiconductor manufacturing are inadequate for evaluating multiple process sequences and materials simultaneously on a single substrate, failing to accommodate variations across multiple steps effectively.
Innovation Solution
A system and method that utilize a cluster tool with combinatorial and conventional processing modules, enabling spatial variation of masks and processes across multiple layers of a substrate without breaking vacuum, allowing for simultaneous evaluation of different materials and process sequences while maintaining a controlled environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If gradient variation technique is used to evaluate materials, then material evaluation can be performed, but the technique cannot accommodate variation across multiple steps so that process sequences cannot be evaluated in combination with material evaluation
Solution Approach 1:
The substrate is divided into multiple discrete regions, each subjected to different process sequences and materials. The processing system is segmented into multiple modules (deposition, etch, oxidation, ion implantation) that can independently process different regions, enabling comprehensive evaluation of process sequences while maintaining manageable system complexity through modular design.
Solution Approach 2:
A single processing system is designed to perform multiple functions by integrating various processing modules (deposition, etch, oxidation, ion implantation) and using programmable control to execute different process sequences on different substrate regions. This universal system can evaluate both materials and process sequences simultaneously without requiring separate specialized equipment for each evaluation type.
2Adaptability or versatility
If multiple masks are used for spatial variation across process sequences, then in-situ variation of spatial location and geometry can be achieved, but the system complexity increases
Solution Approach 1:
The system employs dynamic mask selection and reconfiguration capability, where masks can be programmatically selected and positioned for different processing steps. The mask system is designed to accommodate variation across multiple steps through automated mask changing mechanisms and programmable control, enabling spatial location and geometry variation without manually reconfiguring the entire system for each evaluation scenario.
Solution Approach 2:
Multiple masks with different patterns are used to create variations in spatial location and geometry across different substrate regions. Each mask serves as a template that defines the processing parameters for specific regions, allowing the system to evaluate multiple process sequences simultaneously by copying and adapting proven process patterns across different substrate areas.
3Adaptability or versatility
If substrate is transferred between modules for processing, then different process sequences can be applied, but exposure to deleterious environment occurs
Solution Approach 1:
The system employs an inert or controlled atmosphere environment within the processing chamber and transfer mechanisms. Substrates are transferred between processing modules through vacuum-compatible pathways that maintain controlled atmospheric conditions, preventing exposure to deleterious environments such as air and moisture during inter-module transfer while allowing flexible process sequencing.
4Productivity
If conventional processing is used, then standard manufacturing processes can be performed, but efficient evaluation of multiple materials and process sequences on a single substrate cannot be achieved
Solution Approach 1:
Multiple processing modules (deposition, etch, oxidation, ion implantation) are merged into a single integrated processing system that can handle multiple materials and process sequences on one substrate. The system combines conventional processing capabilities with combinatorial evaluation functionality, allowing efficient evaluation of multiple materials and process sequences simultaneously while maintaining standard manufacturing process quality through integrated control and monitoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient evaluation of multiple materials and process sequences on a single substrate, optimizing semiconductor manufacturing by avoiding exposure to deleterious environments and allowing for in-situ testing of process impacts, thus determining an optimum process sequence.
Implementation Method 1
The successive processing occurs within the cluster tool thereby avoiding a negative environment. The negative environment avoided may include air, moisture and particulate contaminants.
Implementation Method 2
A first site-isolated deposition over a discrete region of the substrate is performed under vacuum.
Implementation Method 3
A second site-isolated deposition over the discrete region of the substrate is performed without breaking vacuum.
Data Source
AI summary
A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.