Semiconductor Heat Dissipation Structure With CNT Thermal Interface
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Solution Overview
Problem
Miniaturized semiconductor devices generate significant heat, which can impair their operation and potentially cause damage due to inadequate thermal management in high-density integration.
Innovation Solution
A semiconductor structure incorporating a thermally conductive nanostructure, such as graphene or carbon nanotubes, between an adhesive and a die to effectively dissipate heat to a heat dissipation member, enhancing thermal conductivity and allowing for secure and reusable attachment of the heat dissipation member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional adhesive is used to attach heat dissipation member to die, then attachment is achieved, but thermal conduction from die to heat dissipation member is insufficient
Solution Approach 1:
The patent uses a composite structure combining adhesive material with vertically aligned carbon nanotubes (VACNT). The VACNT protrude through the adhesive layer to directly contact the die surface, creating a composite thermal pathway that combines the adhesive's bonding function with the nanotubes' high thermal conductivity, thereby resolving the contradiction between achieving attachment and ensuring sufficient thermal conduction.
Solution Approach 2:
The carbon nanotubes act as an intermediary thermal conduction pathway between the die and the heat dissipation member. They bridge the thermal gap that would otherwise be created by the adhesive layer, providing a dedicated high-conductivity route for heat flow while the adhesive provides mechanical bonding.
2Reliability
If heat dissipation member is permanently attached to die, then thermal management is improved, but adhesive cannot be reused and manufacturing flexibility is reduced
Solution Approach 1:
The thermal conduction function is segmented from the adhesive bonding function. The carbon nanotubes provide the thermal conduction pathway while the adhesive provides mechanical bonding. This segmentation allows the adhesive to be detached and reused while the nanotube structure remains on the die, maintaining thermal management performance across multiple attachment cycles.
Solution Approach 2:
The attachment system is made dynamic and reversible rather than permanent. The adhesive can be detached and reattached multiple times while maintaining functional performance, enabling flexible manufacturing processes including rework, repair, and assembly variations without compromising thermal management reliability.
3Temperature
If adhesive layer is made thin to improve thermal conduction, then thermal resistance decreases, but attachment strength and alignment tolerance are reduced
Solution Approach 1:
The composite of adhesive with vertically aligned carbon nanotubes allows the adhesive layer to remain thin for good thermal contact while the nanotubes provide enhanced mechanical interlocking and attachment strength. The nanotubes act as reinforcement elements that compensate for the reduced thickness of the adhesive layer.
Solution Approach 2:
The carbon nanotubes are concentrated at the critical interface regions where thermal conduction and mechanical attachment are most needed - specifically where the adhesive contacts the die surface. This localized enhancement provides both thermal and mechanical benefits without requiring the entire adhesive layer to be thick.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nanostructure effectively conducts heat from the die to the heat dissipation member, improving thermal management, increasing attachment strength, and enabling the reuse of the adhesive, thus enhancing the semiconductor structure's reliability and manufacturing versatility.
Implementation Method 1
the nanostructure is configured to conduct heat from the die to the heat dissipation member
Data Source
AI summary
A semiconductor structure includes a die including a circuitry disposed over a surface of the die or within the die and having specific functions for the die; a heat dissipation member attached to the die by an adhesive disposed between the surface of the die and the heat dissipation member; and a nanostructure disposed between the adhesive and the die, configured to conduct heat from the die to the heat dissipation member, protruding from the adhesive towards the surface of the die and contacting the surface of the die.