Semiconductor Coating Adhesion via Silane-Modified Polyimide Resin
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Solution Overview
Problem
Existing semiconductor device coatings fail to consistently achieve intended adhesion and reliability due to byproducts formed during reactions with energy, leading to potential rupture of thin wire connections and reduced device reliability.
Innovation Solution
A semiconductor device structure incorporating a coating material with covalent bonds between silicon, metal, silicon oxide, and siloxane, applied to both semiconductor elements and wire connections, enhances adhesion and reliability by promoting stable bonding and wettability, even under heat stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating material reacts with energy such as heat, light, or plasma, then the coating material forms a protective layer, but byproducts are produced that reduce adhesion and reliability
Solution Approach 1:
The patent changes the chemical composition parameters of the coating material by incorporating specific ratios of silane-modified polyimide resin (5-50 mass%), silicone resin (5-50 mass%), and polyimide resin (50-90 mass%). This parameter optimization ensures that upon reaction with energy, the coating produces minimal harmful byproducts while maintaining strong adhesion and reliability.
Solution Approach 2:
The patent creates a composite coating material system combining multiple resin types (silane-modified polyimide, silicone resin, and polyimide resin) with complementary properties. This composite structure enables the coating to achieve both protective function and high adhesion while controlling byproduct formation through synergistic material interactions.
2Device complexity
If pieces of wire with small diameters are used to connect semiconductor elements, then the device structure is compact, but the wires are prone to rupture under heat stress
Solution Approach 1:
The patent applies a coating material containing silane-modified polyimide resin and silicone resin beforehand on the semiconductor elements and wire connections. This coating layer acts as a protective cushion that absorbs and distributes heat stress, preventing wire rupture while maintaining compact device structure.
Solution Approach 2:
The patent optimizes the thermal and mechanical parameters of the coating material by controlling the resin composition ratios. This creates a coating layer with appropriate softness and thermal resistance that protects thin wires from heat-induced rupture without compromising device compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure significantly improves the reliability of semiconductor devices by ensuring strong adhesion between semiconductor elements, wires, and sealants, preventing material deterioration and maintaining device integrity under operational stress.
Implementation Method 1
The coating material contains substances with covalent bonds between oxygen and each of silicon and a metal, a silicon oxide, and siloxane
Data Source
AI summary
The object is to provide a technology for enabling enhancement of the reliability of a semiconductor device. The semiconductor device includes: a semiconductor element; a piece of linear wire connected to an upper surface of the semiconductor element; a coating material in contact with the semiconductor element, and the piece of wire in an upper region on the semiconductor element; and a sealant protecting the semiconductor element, the piece of wire, and the coating material, wherein the coating material contains substances with covalent bonds between oxygen and each of silicon and a metal, a silicon oxide, and siloxane.