Semiconductor Coating Layout Near Dicing Lines to Prevent Peeling
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices with coating films in termination regions face issues such as peeling due to developer residue and ineffective region enlargement, which increases manufacturing costs.
Innovation Solution
A method involving a semiconductor structure with a side monitor electrode, passivation film, and coating film, where the thickness of the side monitor electrode is less than the coating film, and the distance between the coating film and the side monitor electrode is set between 15 μm and 1.15 times the length of the side monitor electrode plus 6.88, to prevent peeling and reduce ineffective regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the coating film is provided near the dicing line to reduce ineffective region, then manufacturing cost is reduced, but the coating film may be caught during dicing using a blade
Solution Approach 1:
The patent extracts the coating film from the dicing line region by defining it only in the termination region, separating the functions of the coating film (protection in termination region) from the dicing process (clean cutting in dicing line region). This allows the coating film to be positioned as close as possible to the dicing line without being caught during dicing.
2Reliability
If an opening is provided in the passivation film to coat the concave portion, then developer remaining is suppressed, but the distance between coating film and dicing line must be increased, enlarging ineffective region
Solution Approach 1:
The patent applies local quality by providing the coating film only in the termination region with specific thickness requirements, rather than uniformly coating the entire surface. The coating film thickness is controlled to be between 1.5 μm and 5 μm in the termination region, ensuring adequate protection without requiring additional openings that would increase the ineffective region.
3Reliability
If the coating film is made thicker to prevent peeling, then adhesion is improved, but the ineffective region must be enlarged to accommodate the thicker film
Solution Approach 1:
The patent optimizes the coating film thickness parameter to a specific range (1.5 μm to 5 μm) that provides sufficient adhesion strength to prevent peeling while minimizing the space required. This parameter optimization allows the coating film to maintain reliability without requiring excessive distance from the dicing line, thereby reducing the ineffective region.
Data Source
AI summary
An object is to provide a technique that can suppress peeling of a coating film while reducing an ineffective region. A method of manufacturing a semiconductor device includes a preparation step of preparing a semiconductor structure and a dicing step in which dicing is performed on the dicing line region. A thickness of the side monitor electrode is smaller than a thickness of the coating film, and 15>b>1.15×d+6.88 is established between a distance b [μm], being a distance between the coating film and the side monitor electrode, and a length d [mm], being a length of the side monitor electrode in an extending direction of the dicing line region in plan view.