Single Chip Semiconductor Coating Structure for Direct PCB Welding
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Solution Overview
Problem
The traditional lead-frame packaging structure for semiconductor devices is time-consuming and costly due to its complex manufacturing steps, necessitating a more efficient and reliable method for producing semiconductor packages that can be directly mounted on PCBs.
Innovation Solution
A single chip semiconductor coating structure is developed, featuring an insulating layer on non-conductive surfaces and electrodes with weldability on conductive surfaces, allowing direct welding onto PCBs, thereby simplifying the manufacturing process and eliminating the need for traditional attaching-chip and wire-bonding steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional lead-frame packaging structure is used, then protection and heat-dissipation functions are provided, but manufacturing steps are complex and time-consuming
Solution Approach 1:
The patent extracts and eliminates unnecessary intermediate packaging steps from the traditional lead-frame structure. By directly mounting the semiconductor chip on the PCB with integrated electrodes and connecting layers, it removes the lead-frame, wire-bonding, and molding steps, thereby simplifying the manufacturing process while maintaining protection and heat-dissipation functions through the coating structure itself.
Solution Approach 2:
The patent merges multiple functions into a single integrated coating structure that simultaneously provides electrical connection, mechanical support, and protection. The connecting layers with weldability are integrated directly onto the chip surfaces, combining the functions of electrodes, lead-frames, and protective packaging into one unified structure, thus reducing manufacturing complexity and improving productivity.
2Reliability
If traditional lead-frame packaging structure is used, then protection function is provided, but manufacturing cost is increased
Solution Approach 1:
The patent removes the expensive lead-frame and wire-bonding components from the traditional packaging structure. By using a simplified coating structure with integrated connecting layers directly on the chip, it eliminates the need for separate lead-frames and wire-bonding materials, thereby reducing material costs and manufacturing complexity while maintaining protective functions.
Solution Approach 2:
The patent employs cost-effective coating materials and simplifies the packaging structure to reduce manufacturing costs. The coating structure uses affordable materials that provide sufficient protection without requiring expensive lead-frames, wire-bonding, and complex molding processes, making the overall manufacturing more economical.
3Reliability
If insulating layer is coated on all surfaces, then protection is enhanced, but conductive areas for welding are blocked
Solution Approach 1:
The patent applies different properties to different areas of the chip surface. The insulating layer is coated on the non-conductive surfaces to provide protection, while the conductive areas with pads are left exposed or selectively coated to maintain weldability. This local differentiation allows the structure to simultaneously achieve particle protection and welding capability without compromising either function.
Data Source
AI summary
A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.