Semiconductor Package Column Conductor Structure Against Dicing Peel-Off
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Solution Overview
Problem
Existing semiconductor devices face issues with peeling off of the sealing resin and wires during the dicing process, leading to reliability concerns and manufacturing inefficiencies.
Innovation Solution
The semiconductor device incorporates an insulating member and sealing resin configuration where the column conductor and main face wire are supported by both the insulating member and sealing resin, preventing peeling by ensuring they are sandwiched between these components in the thickness direction, thus stabilizing them during cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing is performed to separate individual semiconductor devices, then productivity is improved, but the sealing resin and wires may peel off from each other
Solution Approach 1:
The invention extends wires in the thickness direction to form column conductors that protrude from the sealing resin. This dimensional extension creates a geometric interlocking structure where the column conductors are sandwiched between the insulating member and sealing resin, preventing peeling during dicing while maintaining electrical connectivity.
Solution Approach 2:
The wire structure is segmented into different functional portions: a main face wire portion for electrical connection, a column conductor portion extending through the sealing resin, and an exposed portion for external connection. This segmentation allows each portion to fulfill its specific function while collectively preventing peeling during the dicing process.
2Adaptability or versatility
If wires are extended to improve connectivity, then adaptability is improved, but device complexity increases
Solution Approach 1:
The column conductor serves multiple functions simultaneously: it provides electrical connectivity from the main face wire to external contacts, acts as a mechanical anchor preventing peeling during dicing, and extends the wire functionality into the thickness direction. This multi-functionality reduces the need for separate structural components.
Data Source
AI summary
A semiconductor device and a manufacturing method of the semiconductor device by which peeling off of a sealing resin and a wire from each other can be practically suppressed are disclosed. The semiconductor device includes a substrate, a main face wire, a semiconductor element that is conductive to the main face wire, a sealing resin having resin side faces directed in a direction crossing a thickness direction, the sealing resin sealing the main face wire and the semiconductor element, a through-wire that is conductive to the main face wire and having an exposed rear face exposed from the substrate, and a column conductor that is conductive to the main face wire and having an exposed side face exposed from the resin side faces. The column conductor is supported from the opposite sides thereof in the thickness direction by the substrate and the sealing resin.