Semiconductor Columnar Electrode Via Formation

Solution Overview

Problem

The existing semiconductor device manufacturing methods, such as the embedded water level package (EWLP) method, require a costly and time-consuming step of forming a via by laser processing to connect wiring lines to the electrode, increasing the number of manufacturing steps and costs.

Innovation Solution

A semiconductor device and manufacturing method that utilize a columnar electrode protruding from the semiconductor substrate, allowing the semiconductor construct to be mounted on a base plate with a sealing layer stacked around it, eliminating the need for laser processing to form a via and reducing the number of manufacturing steps and costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If laser processing is used to form a via to connect wiring lines to the electrode, then reliable electrical connection is achieved, but manufacturing cost and processing time increase

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The via hole is formed in advance during the resin molding process before the wiring lines are formed. The columnar electrode protrudes through the sealing resin, and the via hole is created simultaneously with the resin curing process, allowing subsequent wiring formation to directly connect to the electrode without requiring separate laser drilling operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The via hole formation process is merged with the resin molding and curing process. The resin is molded around the columnar electrode while the via hole is formed in the resin, combining what would traditionally be separate steps (via drilling, electrode installation, resin filling) into a single integrated manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If laser processing is used to form a via to connect wiring lines to the electrode, then reliable electrical connection is achieved, but manufacturing cost increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The via hole is formed in advance during the resin molding process before the wiring lines are formed. The columnar electrode protrudes through the sealing resin, and the via hole is created simultaneously with the resin curing process, allowing subsequent wiring formation to directly connect to the electrode without requiring separate laser drilling operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The via hole formation process is merged with the resin molding and curing process. The resin is molded around the columnar electrode while the via hole is formed in the resin, combining what would traditionally be separate steps (via drilling, electrode installation, resin filling) into a single integrated manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

3Manufacturing precision

If multiple manufacturing steps including laser via formation are used, then precise electrical connection is achieved, but the number of manufacturing steps increases

Engineering Contradiction:

Improveelectrical connection precisionVSAvoidnumber of manufacturing steps

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The via hole is formed in advance during the resin molding process before the wiring lines are formed. The columnar electrode protrudes through the sealing resin, and the via hole is created simultaneously with the resin curing process, allowing subsequent wiring formation to directly connect to the electrode without requiring separate laser drilling operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The via hole formation process is merged with the resin molding and curing process. The resin is molded around the columnar electrode while the via hole is formed in the resin, combining what would traditionally be separate steps (via drilling, electrode installation, resin filling) into a single integrated manufacturing process.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9343428B2Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same

Publication Date: 2016.05.17 AOI ELECTRONICS CO LTD

AI summary

A semiconductor device includes a semiconductor construct including a semiconductor substrate and an external connection electrode provided to protrude on a surface of the semiconductor substrate, a base plate on which the semiconductor construct is installed, and a sealing layer stacked on the semiconductor substrate except for the external connection electrode and on the base plate including a side surface of the semiconductor substrate.