Semiconductor Device Columnar Insulating Structure
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Solution Overview
Problem
Current semiconductor manufacturing methods for three-dimensional memory devices face challenges in efficiently connecting electrode layers with stable and reliable contact structures, particularly in maintaining uniform distances and preventing shorts between electrode layers.
Innovation Solution
The semiconductor device incorporates a stairstep configuration of electrode layers with insulating layers and columnar portions made of different materials, where the columnar portions extend through the insulating layer and stacked body, and contact portions are connected to the terrace portions with uniform shortest distances, allowing for precise alignment and reduced chip size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a stairstep-shaped contact structure is used to connect multiple electrode layers, then the connection between electrode layers and control circuit is achieved, but the manufacturing complexity and alignment precision requirements increase
Solution Approach 1:
The contact structure is divided into multiple contact portions, each corresponding to different electrode layers. The columnar portions are segmented into multiple sections with different insulating materials, allowing independent optimization of each segment for its specific function in the stacking direction.
Solution Approach 2:
Columnar portions filled with insulating materials serve as intermediary structures between the electrode layers and the control circuit. These columnar portions with different insulating materials prevent electrical shorts while maintaining structural support and enabling precise alignment through their uniform distance configuration.
2Reliability
If columnar portions with different insulating materials are used to support electrode layers, then shorts between electrode layers are prevented, but the device complexity increases
Solution Approach 1:
Different insulating materials are placed in different regions of the columnar portions based on local requirements. The first insulating material is used in regions requiring higher electrical isolation, while the second insulating material is used in other regions, optimizing both short prevention and structural simplicity.
Solution Approach 2:
The columnar portions are constructed as composite structures containing multiple insulating materials with different properties. This composite approach enables the single columnar structure to fulfill multiple functions: electrical isolation, mechanical support, and alignment reference, thereby reducing overall device complexity despite the multi-material composition.
3Manufacturing precision
If uniform shortest distances are maintained between contact portions and columnar portions, then alignment precision is improved, but the chip surface area increases
Solution Approach 1:
The alignment precision is achieved by utilizing the vertical dimension (stacking direction) through the columnar portions' structured insulating materials, rather than relying solely on horizontal spacing. This allows for compact chip footprint while maintaining precise alignment through the vertical stratification of insulating layers within the columnar portions.
Data Source
AI summary
According to one embodiment, columnar portions extend through an insulating layer and through a stacked body under the insulating layer. The columnar portions are of an insulating material different from the insulating layer. Contact portions include a first contact portion disposed inside a first terrace portion and a second contact portion disposed inside a second terrace portion. The columnar portions including a first columnar portion disposed inside the first terrace portion and a second columnar portion disposed inside the second terrace portion. A shortest distance between the first contact portion and the first columnar portion, and a shortest distance between the second contact portion and the second columnar portion are substantially equal to each other.