Semiconductor Device Common Source Terminal and Flush Layout
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Solution Overview
Problem
Conventional semiconductor devices requiring external connection of source terminals for bidirectional switching pose challenges in miniaturization and internal terminal arrangement.
Innovation Solution
A semiconductor device design featuring a common source terminal that electrically connects the source electrodes of two MOSFETs internally, eliminating the need for external connections and allowing for a more compact layout with flush terminal surfaces within a sealing resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If source terminals are connected externally for bidirectional switching, then the device can function as a bidirectional switch, but the device size increases and miniaturization is hindered
Solution Approach 1:
The patent merges the source terminals of the first and second MOSFETs into a single common source terminal structure. The source electrode of the first MOSFET and the source electrode of the second MOSFET are both connected to the same common source terminal, eliminating the need for separate external connections. This integration reduces the number of external terminals required and enables device miniaturization while maintaining bidirectional switching functionality.
2Ease of operation
If lead terminals project from the outer surface of the sealing resin, then external connections are simplified, but the device size increases and miniaturization is prevented
Solution Approach 1:
The patent transitions the terminal arrangement from a three-dimensional protruding structure to a two-dimensional planar structure. Instead of lead terminals projecting outward from the sealing resin surface in the vertical dimension, all terminals are arranged flush with the outer surface of the sealing resin in the same plane. This dimensional change eliminates the need for additional vertical space, enables miniaturization, while maintaining ease of external connections through the flush arrangement.
3Adaptability or versatility
If separate source terminals are used for each MOSFET, then each terminal can be independently connected, but the internal terminal arrangement becomes complex and device size increases
Solution Approach 1:
The patent combines multiple source terminals into a single common source terminal that serves both MOSFETs. The common source terminal structure integrates the source electrode connections of the first and second MOSFETs, simplifying the internal terminal arrangement from multiple separate terminals to a unified structure. This reduction in terminal count decreases device complexity while maintaining the flexibility needed for bidirectional switching operations.
Data Source
AI summary
A semiconductor device 1 includes a first drain terminal 4, connected to a drain electrode of a first semiconductor chip, a first gate terminal 5, connected to a gate electrode of the first semiconductor chip, a second drain terminal 6, connected to a drain electrode of a second semiconductor chip, a second gate terminal 7, connected to a gate electrode of the second semiconductor chip, a common source terminal 8, connected to a source electrode of the first semiconductor chip and a source electrode of the second semiconductor chip, and a sealing resin 9, sealing the respective semiconductor chips and the respective terminals. The respective terminals have exposed surfaces (lower surfaces) 43, 53, 63, 73, and 83 substantially flush with an outer surface (lower surface) 9b of the sealing resin 9 and exposed from the outer surface 9b.