Semiconductor Temperature Compensation Circuit Design
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Solution Overview
Problem
Existing semiconductor devices face challenges in accurately controlling memory cells across varying temperatures, which affects the performance and reliability of data storage operations.
Innovation Solution
A semiconductor device is designed with a temperature compensation circuit that digitally converts a voltage output by a temperature sensor and divides it into sections, allowing for precise calculation of a temperature compensation voltage in an analog manner, thereby swiftly and accurately sensing temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature compensation circuit digitally converts voltage and divides it into sections for analog calculation, then temperature sensing accuracy is improved, but device complexity increases
Solution Approach 1:
The temperature range is divided into multiple sections, with each section having dedicated compensation values stored in registers. The temperature compensation voltage is calculated by selecting and combining compensation values corresponding to different temperature sections, enabling accurate temperature compensation across the entire range while maintaining manageable circuit complexity through modular organization
Solution Approach 2:
An analog-to-digital converter (ADC) is introduced as an intermediary component to convert the temperature sensor voltage into a digital code that can be processed by the control logic. This intermediary enables precise temperature measurement and facilitates the selection of appropriate compensation values from storage registers, bridging the gap between analog sensing and digital processing
2Reliability
If temperature compensation is implemented across multiple sections, then performance reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The compensation values stored in registers are determined based on actual temperature characteristics measured during the manufacturing process. By adjusting these stored parameter values according to specific device measurements, the patent achieves reliable temperature compensation tailored to each device's actual performance without requiring complex manufacturing processes
Solution Approach 2:
Temperature compensation values are pre-calculated and stored in registers during the manufacturing process. This preliminary action allows the device to operate with accurate temperature compensation from the start, eliminating the need for complex real-time adjustments and simplifying both manufacturing and operation
Data Source
AI summary
A semiconductor device includes a first voltage generating circuit configured to output a first voltage based on temperature; an analog-to-digital converter configured to convert the first voltage into a temperature code; a code conversion logic configured to output an offset code and a level code of a temperature section which the temperature belongs among temperature sections based on the temperature code; an offset voltage generating circuit configured to output an offset voltage based on the offset code; a second voltage generating circuit configured to output a second voltage having a constant value within a temperature section based on the level code; and a temperature compensation voltage generating circuit configured to receive the first voltage, the second voltage, the offset voltage, and a feedback voltage and output a temperature compensation voltage, the feedback voltage based on the first voltage, the second voltage, and the offset voltage.