Semiconductor Compensation Device Subzone Segmentation

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Solution Overview

Problem

Semiconductor compensation devices face performance degradation due to production tolerances and lithographic mismatches, leading to deviations in the compensation of n- and p-doped regions, which affect device breakdown voltage and on-resistance.

Innovation Solution

The semiconductor compensation device employs a specific arrangement of first and second semiconductor subzones of different conductivity types, with precise dopant concentration profiles and electrochemical alkaline wet etching to adjust the thickness of these subzones, ensuring precise charge compensation and minimizing the impact of production tolerances.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If n- and p-doped regions are spatially arranged for charge compensation, then on-resistance is reduced, but device breakdown voltage decreases due to production tolerances and lithographic mismatches

Engineering Contradiction:
Improveon-resistanceVSAvoiddevice breakdown voltage
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The drift zone is segmented into multiple subzones with alternating n-type and p-type doping regions. This segmentation allows independent optimization of each subzone's dopant concentration and dimensions, compensating for production tolerances and lithographic mismatches while maintaining charge compensation and reducing on-resistance

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different subzones within the drift zone have locally optimized dopant concentrations and geometries. Each subzone is tailored to achieve precise charge compensation, with varying dopant concentrations and dimensions to account for production variations, thereby maintaining high breakdown voltage while achieving low on-resistance

Inventive Principle:
Principle #3Local quality

2Strength

If dopant concentration in drift zone is increased to reduce on-resistance, then RDS(on) improves, but device breakdown voltage decreases

Engineering Contradiction:
Improveon-resistanceVSAvoiddevice breakdown voltage
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The drift zone is divided into multiple subzones with alternating doping types, allowing the total dopant concentration to be distributed across multiple regions. This enables achieving low on-resistance through cumulative dopant effect while maintaining high breakdown voltage through charge compensation between subzones

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention changes the doping parameters by introducing alternating n-type and p-type subzones with specifically controlled dopant concentrations. This parameter configuration allows the drift zone to simultaneously achieve low resistance through high total dopant content and high breakdown voltage through charge compensation

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the device's breakdown voltage and on-resistance by achieving precise dopant compensation, reducing the negative effects of production variations and improving overall performance.

Implementation Method 1

electrochemical alkaline wet etching to adjust the thickness of these subzones

Methodology Applied
Scientific EffectElectrochemical alkaline wet etching: Electrolysis

Data Source

PatentUS8759202B2Semiconductor device and manufacturing method
Publication Date: 2014.06.24 INFINEON TECH AUSTRIA AG
  • US8759202B2 patent drawing
  • US8759202B2 patent drawing
  • US8759202B2 patent drawing

AI summary

A semiconductor device includes a drift zone of a first conductivity type formed within a semiconductor body, wherein one side of opposing sides of the drift zone adjoins a first zone within the semiconductor body and the other side adjoins a second zone within the semiconductor body. First semiconductor subzones of a second conductivity type different from the first conductivity type are formed within each of the first and second zones opposing each other along a lateral direction extending parallel to a surface of the semiconductor body. A second semiconductor subzone is formed within each of the first and second zones and between the first semiconductor subzones along the lateral direction. An average concentration of dopants within the second semiconductor subzone along 10% to 90% of an extension of the second semiconductor subzone along a vertical direction perpendicular to the surface is smaller than the average concentration of dopants along a corresponding section of extension within the drift zone.