Low-Profile Semiconductor Component for Backlight Units
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Solution Overview
Problem
Conventional LED configurations in backlit liquid crystal displays of handheld devices are unable to achieve the required reduction in construction height while providing sufficient luminous flux, necessitating a more compact and cost-efficient optoelectronic semiconductor component.
Innovation Solution
The development of an optoelectronic semiconductor component with a low construction height, featuring a semiconductor chip with a semiconductor layer sequence and a molded body that is electrically insulating and reflective, allowing for efficient radiation output and electrical contacting, and a method for producing such components using overmolding and singulation techniques to create a compact, high-luminous flux device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional LED configurations are used, then sufficient luminous flux can be provided, but the construction height cannot be reduced
Solution Approach 1:
The patent transitions from vertical stacking of multiple LED chips to a planar arrangement where multiple semiconductor chips are mounted on a common substrate in a two-dimensional configuration. This dimensional change allows sufficient luminous flux to be achieved through lateral expansion rather than vertical stacking, thereby reducing construction height while maintaining lighting performance
Solution Approach 2:
Multiple semiconductor chips are combined on a single common substrate with shared electrical contacts and housing structures. The housing encloses multiple chips and their contacts in a unified structure, merging what would traditionally be separate vertical LED assemblies into a single low-profile component that achieves equivalent or greater luminous flux through the combined output of multiple chips arranged in parallel
2Illumination intensity
If multiple semiconductor chips are used to increase luminous flux, then sufficient radiation output is achieved, but device complexity increases
Solution Approach 1:
The common substrate serves multiple functions simultaneously: it provides mechanical support for multiple semiconductor chips, establishes electrical connections to all chips through shared contact structures, and acts as a mounting platform for the unified housing. This multi-functionality reduces the number of separate components needed, thereby lowering overall device complexity despite incorporating multiple chips for enhanced luminous flux
Solution Approach 2:
The housing structure is designed to enclose multiple semiconductor chips and their electrical contacts in a single unified enclosure rather than separate housings for each chip. This merging of structural elements simplifies assembly and reduces the number of discrete parts, offsetting the increased complexity that would normally arise from using multiple chips
3Length of moving object
If the radiation output side runs parallel to active regions, then compact design is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The semiconductor chips are pre-mounted and electrically connected to the substrate and contact structures before the final housing is attached. This preliminary assembly establishes precise alignment relationships between the chips, contacts, and substrate in advance, allowing the housing to be added as a final enclosing step without requiring complex real-time alignment procedures, thereby reducing manufacturing precision requirements despite the compact parallel configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact semiconductor component that provides sufficient luminous flux with a reduced construction height, suitable for use in handheld devices, and allows for efficient production, reducing the overall operating voltage and enhancing adaptability to specific application requirements.
Implementation Method 1
a semiconductor layer sequence (200) having an active region (20) provided for the generation of radiation
Implementation Method 2
the molded body is designed to be reflecting for the generated radiation, e.g. with a reflectivity of at least 60%, e.g. at least 80%
Data Source
AI summary
The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a molded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the molded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.