Semiconductor Component Mounting Using Positioning Plate Alignment
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Solution Overview
Problem
Existing methods for forming external connections in semiconductor devices are not entirely satisfactory, particularly in terms of component alignment and yield, due to issues with component positioning and contamination by solder paste or flux.
Innovation Solution
A method and apparatus that utilize a positioning plate with through holes and a manipulation drive for aligning and inserting components, combined with a vacuum system and enforcing elements to ensure accurate placement and secure attachment to a substrate, avoiding direct contact with solder paste and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If components are placed directly on the substrate using conventional methods, then the process is simple, but component alignment precision and yield deteriorate due to contamination by solder paste or flux
Solution Approach 1:
The patent introduces a positioning plate as an intermediary carrier between the component and the substrate. The positioning plate has through-holes that precisely guide component placement and can be removed after mounting, preventing contamination of the component by solder paste or flux while maintaining high alignment precision.
Solution Approach 2:
The mounting process is segmented into distinct stages: component placement on the positioning plate, positioning plate transfer to substrate, component attachment to substrate, and positioning plate removal. This segmentation allows each stage to be optimized independently, improving overall precision without excessive complexity.
2Manufacturing precision
If a positioning plate with through holes is used for component alignment, then alignment precision improves, but the device complexity increases due to additional components and processes
Solution Approach 1:
The positioning plate serves as a temporary intermediary structure that provides precise alignment features (through-holes) during the mounting process. After the component is securely attached to the substrate, the positioning plate is removed, leaving no permanent complexity in the final device structure.
Solution Approach 2:
The positioning plate is prepared in advance with precisely positioned through-holes that match the component and substrate alignment requirements. This preliminary preparation of alignment features eliminates the need for complex real-time adjustment mechanisms during the mounting process.
3Productivity
If conventional mounting methods are used, then the process is straightforward, but contamination by solder paste or flux reduces yield
Solution Approach 1:
The positioning plate acts as a protective intermediary that prevents direct contact between the component and contaminating materials (solder paste or flux). The component is attached to the positioning plate first in a clean environment, then the entire assembly is transferred to the substrate, eliminating contamination risks and improving manufacturing yield.
4Strength
If force is applied to secure components to the substrate, then attachment strength improves, but component misalignment may occur due to uneven force distribution
Solution Approach 1:
The positioning plate serves as a rigid intermediary that maintains precise component alignment during the force application process. Force can be applied uniformly to the positioning plate without affecting component position, as the positioning plate's through-holes and component geometry ensure proper alignment is maintained throughout the attachment process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the alignment and secure mounting of components, reduces contamination, and increases the mechanical strength and reliability of semiconductor devices by using non-spherical components and evenly distributing force for stable attachment.
Implementation Method 1
a vacuum system and enforcing elements to ensure accurate placement and secure attachment to a substrate
Data Source
AI summary
A method for mounting components on a substrate is provided. The method includes providing a positioning plate which has a plurality of through holes. The method further includes supplying components each having a longitudinal portion on the positioning plate. The method also includes performing a component alignment process to put the longitudinal portions of the components in the through holes. In addition, the method includes connecting a substrate to the components which have their longitudinal portions in the through holes and removing the positioning plate.