Semiconductor Package Conductive Ball Planarization
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high integration density and reliable electrical connections in Package-on-Package (PoP) technology due to limitations in controlling the contact area and height variation of conductive balls in semiconductor packaging, which affects the reliability of electrical connections between components.
Innovation Solution
A manufacturing method involving a supporting element with conductive balls, a debond layer, and an adhesive layer, where the conductive balls are pressed into the adhesive layer, encapsulated in a molding compound, and planarized to create controlled planar and non-planar end portions for improved contact areas and reduced height variation, enabling enhanced electrical connections and package integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional packaging methods are used, then manufacturing simplicity is maintained, but manufacturing precision of conductive ball contact area and height is insufficient
Solution Approach 1:
The conductive ball structure is segmented into two distinct portions: a first portion embedded in the adhesive layer and a second portion protruding from the molding compound. This segmentation allows independent control and optimization of each portion's characteristics, enabling precise control over contact area and height variation without complicating the overall manufacturing process
Solution Approach 2:
The conductive balls are pressed into the adhesive layer before the molding compound is applied, creating a predetermined structure with controlled contact area. This preliminary action ensures that the contact area and height parameters are established early in the process, improving manufacturing precision without requiring complex post-processing steps
2Reliability
If conductive balls are fully embedded in molding compound, then structural stability is improved, but electrical connection reliability deteriorates due to insufficient contact area
Solution Approach 1:
Different portions of the conductive ball structure are assigned different qualities and functions: the first portion (embedded in adhesive) provides structural stability and electrical connection, while the second portion (protruding from molding) provides enhanced contact area for subsequent bonding. This local differentiation resolves the contradiction between stability and connection reliability
Solution Approach 2:
The conductive ball structure transitions from a single-dimensional embedded configuration to a two-dimensional protruding structure. The second portion extends beyond the molding compound surface, adding a new dimension that increases contact area and improves electrical connection reliability while maintaining structural stability through the embedded first portion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the reliability of electrical connections and increases the process window for forming redistribution layers, allowing for more precise control over contact areas and reducing total height variation, thereby enhancing the integration density and stability of semiconductor packages.
Implementation Method 1
The molding compound is planarized and a portion of each of the conductive balls is removed
Data Source
AI summary
A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package has at least one die, conductive balls, and a molding compound. The at least one die and conductive balls are molded in a molding compound. Each of the conductive balls has a planar end portion and a non-planar end portion opposite to the planar end portion. A surface of the planar end portion of each of the conductive balls is substantially coplanar and levelled with a surface of the molding compound and a surface of the at least one die, and the non-planar end portion of each of the conductive balls protrudes from the molding compound.