Semiconductor Light Emitting Element Conductive Layer Edge Positioning
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Solution Overview
Problem
There is a need to enhance the efficiency and reliability of semiconductor light emitting elements, such as LEDs, which currently face challenges in maintaining high performance and longevity due to issues like peeling off of conductive layers and chemical deterioration.
Innovation Solution
The semiconductor light emitting element design includes a laminated body with a first and second semiconductor layer, a third semiconductor layer acting as an active layer, and a conductive layer that connects the second semiconductor layer to an electrode, with the conductive layer's outer edge positioned inside the laminated body to prevent peeling and chemical deterioration, using nitride semiconductor materials and specific metal layers for high reflectance and low resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive layer extends to the outer edge of the laminated body to maximize electrical connection, then electrical conductivity is improved, but the conductive layer is prone to peeling off and chemical deterioration
Solution Approach 1:
The patent applies local quality by creating a recessed portion in the conductive layer at its outer edge, where the depth of the recessed portion varies across different locations. This localized structural modification provides enhanced protection at the vulnerable outer edge while maintaining the electrical conductivity function in the central regions, thus resolving the contradiction between conductivity and stability.
Solution Approach 2:
The recessed portion is formed in advance during the manufacturing process, before the device undergoes operational stress. This preliminary structural preparation prevents peeling and chemical deterioration from occurring in the first place, rather than attempting to repair damage after it occurs.
2Reliability
If the conductive layer is positioned inside the outer edge of the laminated body to prevent peeling, then reliability is improved, but the electrical connection area is reduced
Solution Approach 1:
The patent transitions from a two-dimensional planar conductive layer to a three-dimensional structure with a recessed portion. By creating depth variation in the conductive layer, the solution maintains adequate electrical connection area while the recessed edge provides mechanical protection, thus resolving the contradiction between stability and connection area.
3Ease of manufacture
If the outer edge of the conductive layer is exposed to maximize manufacturing simplicity, then ease of manufacture is improved, but chemical deterioration occurs
Solution Approach 1:
The recessed portion is implemented only at the outer edge region of the conductive layer, while the central regions maintain their original structure. This localized modification protects against chemical deterioration at the vulnerable edge without complicating the manufacturing of the main conductive area.
Solution Approach 2:
The recessed portion acts as an intermediary protective structure between the conductive layer and the external environment. It provides a physical barrier that reduces direct exposure to chemicals while maintaining the electrical function, thus resolving the contradiction between manufacturing simplicity and chemical resistance.
Data Source
AI summary
A semiconductor light emitting element of an embodiment includes a laminated body having first, second, and third semiconductor layers stacked on each other in a first direction, the third semiconductor layer being between the first and second semiconductor layers in the first direction. The laminated body includes a first region and a second region spaced from the first region a second direction which intersects the first direction. The first electrode is electrically connected to the first semiconductor layer. The second electrode is disposed between the first region and the second region along the second direction. The first conductive layer electrically connects the second semiconductor layer and the second electrode to each other. An outer edge of the first conductive layer is positioned inside an outer edge of the laminated body.