Semiconductor Device Conductive Layer Heat Dissipation
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Solution Overview
Problem
Semiconductor devices with Hall elements face challenges in heat dissipation due to low thermal conductivity of insulating materials, leading to performance hindrance in thinner electronic equipment.
Innovation Solution
A semiconductor device design featuring a conductive layer with metal particles in contact with the semiconductor element's reverse and side surfaces, and terminals with dent portions, enhancing heat dissipation while maintaining a reduced height through efficient thermal conductivity and structural configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If an insulating layer is arranged in close contact with the reverse surface of the pellet to achieve height reduction, then the height of the semiconductor device is reduced, but heat dissipation performance deteriorates due to low thermal conductivity of the insulating paste
Solution Approach 1:
A conductive layer containing metal particles (silver, aluminum, or copper) is introduced as an intermediary between the semiconductor element and the sealing resin. This conductive layer has high thermal conductivity and serves as a heat dissipation path, allowing heat to be efficiently conducted from the semiconductor element to the sealing resin while still achieving height reduction of the device
Solution Approach 2:
The conductive layer is formed as a composite material containing metal particles (silver, aluminum, or copper) dispersed in a resin matrix. This composite structure combines the thermal conductivity of metal particles with the structural properties of the resin, achieving both height reduction and improved heat dissipation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated during operation, preventing performance degradation and achieving height reduction in thinner electronic devices.
Implementation Method 1
The conductive layer is in contact with the reverse surface and the side surface and contains metal particles... since the heat dissipation performance of the insulating paste is relatively low due to its material characteristics, heat is likely to build up inside the semiconductor device
Data Source
AI summary
A semiconductor device includes a semiconductor element, a conductive layer, terminals, and a sealing resin. The conductive layer, containing metal particles, is in contact with the reverse surface and the side surface of the semiconductor element. The terminals are spaced apart from and electrically connected to the semiconductor element. The sealing resin covers the semiconductor element. The conductive layer has an edge located outside of the semiconductor element as viewed in plan. Each terminal includes a top surface, a bottom surface, an inner side surface held in contact with the sealing resin, and the terminal is formed with a dent portion recessed from the bottom surface and the inner side surface. The conductive layer and the bottom surface of each terminal are exposed from a bottom surface of the sealing resin.