Semiconductor Package Conductive Layer Segmentation
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Solution Overview
Problem
The existing semiconductor device packaging process faces challenges with the removal of seed layers, which can lead to delamination and increased costs due to discarded packages that fail electrical tests, especially when the bottom patterned conductive layer has limited bonding to the carrier.
Innovation Solution
A semiconductor device package design featuring a carrier with a patterned passivation layer and a first patterned conductive layer, where the conductive layer is partially converted into an insulation medium, allowing for electrical disconnection and improved handling during manufacturing, reducing delamination risks and enabling cost-effective testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the seed layer is removed after the semiconductor device package is formed, then the RDL structure can be tested for electrical functionality, but the entire package must be discarded if it fails the test, increasing manufacturing cost and waste
Solution Approach 1:
The conductive layer is segmented into multiple portions (first portion, second portion, third portion) that are electrically disconnected from each other. This segmentation allows individual portions to be tested and removed independently, enabling failure isolation without discarding the entire package.
Solution Approach 2:
The seed layer is extracted and removed at an intermediate stage before the complete package is formed. This allows electrical testing of the RDL structure to be performed on a modular basis, and only the specific failed portions need to be removed rather than the entire expensive package.
2Loss of substance
If the seed layer is removed after the bottom patterned conductive layer is formed, then manufacturing cost is reduced by saving failed packages, but the bonding between the conductive layer and carrier becomes insufficient, causing delamination and peeling issues
Solution Approach 1:
The conductive layer is prepared with multiple disconnected portions in advance, before final package assembly. This preliminary configuration allows the layer to maintain adequate bonding to the carrier during manufacturing while enabling selective removal of failed portions later through the insulation medium interface.
Solution Approach 2:
An insulation medium is introduced as an intermediary between the carrier and the first portion of the conductive layer. This mediator allows electrical testing to be performed while maintaining physical connection and bonding strength, preventing delamination during the testing process.
3Ease of operation
If the bottom patterned conductive layer maintains strong bonding to the carrier for handling, then manufacturing handling is improved, but the layer cannot be selectively removed for testing purposes
Solution Approach 1:
Different portions of the conductive layer have different local qualities: the second and third portions maintain strong bonding to the carrier for handling, while the first portion is electrically disconnected and can be selectively removed through the insulation medium for testing purposes.
Data Source
AI summary
A semiconductor device package includes a carrier, a patterned passivation layer and a first patterned conductive layer. The patterned passivation layer is disposed on the carrier. The first patterned conductive layer is disposed on the carrier and surrounded by the patterned passivation layer. The first patterned conductive layer has a first portion and a second portion electrically disconnected from the first portion. The first portion has a first surface adjacent to the carrier and exposed by the patterned passivation layer. The second portion has a first surface adjacent to the carrier exposed by the patterned passivation layer. The first surface of the first portion is in direct contact with an insulation medium.