Semiconductor Package Conductive Layout to Prevent Bond Cracking
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Solution Overview
Problem
Conventional semiconductor devices face challenges in manufacturing and operational reliability due to bonding processes and potential cracking or delamination issues, particularly in the integration of terminals and conductive members, which complicates the manufacturing process and affects device performance.
Innovation Solution
The semiconductor device design integrates first and second conductive members with specific bonding parts and ramp parts, and uses a sealing resin to cover semiconductor elements and substrate portions, avoiding the need for bonding processes and enhancing rigidity and reliability, with conductive members electrically connecting semiconductor elements and terminals in a way that disperses current flow to prevent concentration and align with substrate warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding processes are used to integrate terminals and conductive members, then electrical connection is achieved, but manufacturing complexity increases and reliability decreases due to potential cracking or delamination
Solution Approach 1:
The conductive member is designed as an integrated structure that combines both the terminal function and the current distribution function. The first conductive member integrates the first terminal and first conductive part, while the second conductive member integrates the second terminal and second conductive part. This merging eliminates the need for separate bonding processes between terminals and conductive members, thereby reducing manufacturing complexity and avoiding bonding-related reliability issues such as cracking or delamination.
2Duration of action of stationary object
If conventional bonding processes are used, then electrical connection is established, but cracking and delamination may occur reducing device lifespan
Solution Approach 1:
By integrating the terminal and conductive part into a single conductive member structure, the invention eliminates the bonding interface that would otherwise be prone to cracking and delamination. The integrated design ensures structural integrity throughout the device lifespan without the harmful effects of bonding failures.
Solution Approach 2:
The conductive members are segmented into distinct functional parts (terminal portion and conductive part portion) that are integrally formed. This segmentation allows each part to perform its specific function while maintaining structural continuity, preventing the separation and delamination that would occur in bonded structures.
3Productivity
If current flow is concentrated in specific areas, then electrical connection is efficient, but hot spots and performance degradation occur
Solution Approach 1:
The conductive members are designed with varying local properties to optimize current distribution. The conductive parts extend in the second direction (aligned with substrate warping) and have specific width and thickness variations that create favorable current density distribution. This local quality variation ensures efficient current conduction while preventing hot spots by distributing current flow across broader areas where needed.
Solution Approach 2:
The conductive parts extend in the second direction, which is aligned with the substrate warping direction, adding a dimensional aspect to current distribution. This extension in the second direction, combined with the first direction (thickness direction), creates a two-dimensional current distribution pattern that effectively disperses current flow and prevents concentration in single-point hot spots.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, enhances operational reliability by preventing cracking and delamination, and ensures efficient current distribution, thereby improving the semiconductor device's performance and lifespan.
Implementation Method 1
a sealing resin covering the plurality of first semiconductor elements, the plurality of second semiconductor elements, the first conductive member, the second conductive member, a portion of the supporting substrate, and a portion of the first terminal
Implementation Method 2
a first conductive member electrically connecting the plurality of first semiconductor elements and the second conductive part; a second conductive member electrically connecting the plurality of second semiconductor elements and the first terminal
Data Source
AI summary
A semiconductor device includes a supporting substrate, a plurality of first semiconductor elements, a plurality of second semiconductor elements, a first terminal, a first conductive member electrically connecting the plurality of first semiconductor elements and the second conductive part, a second conductive member electrically connecting the plurality of second semiconductor elements and the first terminal, and a sealing resin. The first conductive member includes a plurality of first bonding parts bonded to the first semiconductor elements, and a second bonding part bonded to the second conductive part. The second conductive member includes a plurality of third bonding parts bonded to the plurality of second semiconductor elements. The third bonding parts include: two flat sections each bonded to the second semiconductor elements and aligned in a y direction; and two first inclined sections connected to outer ends of the two flat sections in the y direction.