Semiconductor Package with Conductive Strap and EMI Shield
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to relatively low performance.
Innovation Solution
The semiconductor device comprises a semiconductor die, a redistribution structure, an interconnect, a conductive strap, an encapsulant, and an EMI shield, with a method that includes forming a buildup dielectric layer on the die top side, patterning it to expose die terminals, and applying conductive materials to create a conductive path, followed by encapsulation and EMI shielding to provide protection and electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size becomes too large and cost increases
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional vertical stacking, with multiple semiconductor dies stacked along the vertical axis and interconnected through through-silicon vias (TSVs). This dimensional change enables significant reduction in package footprint while maintaining high interconnect density and functionality.
Solution Approach 2:
The patent implements nested structures where conductive straps are embedded within encapsulant material, which in turn is surrounded by EMI shielding layers. The redistribution layers are nested within dielectric materials, creating compact hierarchical structures that maximize space utilization and reduce overall package volume.
2Reliability
If conventional semiconductor packages are used, then manufacturing process is simpler, but reliability decreases
Solution Approach 1:
The patent performs preliminary actions by forming through-silicon vias and conductive straps before final die stacking and encapsulation. The redistribution layers are pre-formed on each die before assembly, ensuring proper electrical connections are established early in the process, which improves reliability by preventing connection failures.
Solution Approach 2:
The patent introduces encapsulant material as an intermediary that bonds multiple semiconductor dies together and provides mechanical support. The EMI shielding layers serve as intermediaries that protect sensitive circuits from electromagnetic interference, thereby enhancing overall device reliability without requiring direct modification of the semiconductor circuits themselves.
3Reliability
If conventional semiconductor packages are used, then manufacturing cost is lower, but performance becomes relatively low
Solution Approach 1:
The patent segments the semiconductor device into multiple functional layers including separate signal routing layers, power distribution layers, and EMI shielding layers. This segmentation allows each layer to be optimized independently for its specific function, improving overall device performance while enabling parallel manufacturing processes that can reduce costs.
Solution Approach 2:
The patent employs composite structures combining different materials with complementary properties: conductive straps made of copper or aluminum for low-resistance connections, encapsulant materials providing mechanical strength and environmental protection, and EMI shielding materials with high electromagnetic attenuation. These composite structures achieve superior performance that would be difficult to obtain with single materials.
Data Source
AI summary
An exemplary semiconductor device can comprise a die, a redistribution structure (RDS), an interconnect, a conductive strap, an encapsulant, and an EMI shield. The redistribution structure can comprise an RDS top surface coupled to the die bottom side. The interconnect can be coupled to the RDS bottom surface. The conductive strap can be coupled to the RDS, and can comprise a strap inner end coupled to the RDS bottom surface, and a strap outer end located lower than the RDS bottom surface. The encapsulant can encapsulate the conductive strap and the RDS bottom surface. The EMI shield can cover and contact the encapsulant sidewall and the strap outer end. Other examples and related methods are also disclosed herein.