Semiconductor Conductor Grooves Guide Excess Solder
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Solution Overview
Problem
In semiconductor devices, excessive solder can spread uncontrollably, leading to stress on the semiconductor element and degradation of device reliability due to insufficient absorption by grooves in the second conductor.
Innovation Solution
Incorporating grooves on the side surfaces of the first conductor to guide excessive solder into specific positions, limiting its spread and reducing stress on the semiconductor element, with the grooves optionally extending to the upper or lower surfaces of the conductor and positioned at corner portions for enhanced effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If grooves are provided only in the second conductor, then excessive solder is absorbed, but solder may still spread along the side surface of the first conductor causing stress on the semiconductor element
Solution Approach 1:
The invention divides the solder containment function across multiple components: grooves in the second conductor and grooves in the first conductor. This segmentation ensures that solder spreading is controlled at multiple locations, preventing stress concentration on the semiconductor element while maintaining reliable electrical connections.
Solution Approach 2:
Grooves are pre-formed in the first conductor before the soldering process. These grooves are positioned to intercept and guide excessive solder away from critical areas before the solder can spread and create harmful stress on the semiconductor element during the bonding process.
2Ease of manufacture
If grooves extend to the upper or lower surfaces of the first conductor, then excessive solder is easily guided into the grooves, but the structure becomes more complex
Solution Approach 1:
The grooves in the first conductor are provided locally at specific positions where solder spreading is most problematic, rather than throughout the entire conductor. This localized approach effectively guides excessive solder while minimizing the added structural complexity and maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively directs excessive solder into grooves, minimizing stress on the semiconductor element and preventing solder connections that could degrade device reliability, thereby enhancing the reliability of the semiconductor device.
Implementation Method 1
the at least one groove extending in a stacking direction of the semiconductor element, the first conductor, and the second conductor on a side surface adjacent to the upper surface of the first conductor is provided. When the first conductor and the second conductor are soldered or when the first conductor and the semiconductor element are soldered, excessive solder is guided to the grooves formed on the side surfaces of the first conductor.
Data Source
AI summary
A semiconductor device includes a semiconductor element, a first conductor bonded to an upper surface of the semiconductor element via a first solder layer, and a second conductor bonded to an upper surface of the first conductor via a second solder layer. The first conductor includes at least one groove formed in a stacking direction of the semiconductor element, the first conductor, and the second conductor on a side surface adjacent to the upper surface of the first conductor.