Semiconductor Conductor Layout for Heat Dispersion and Warpage Control
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Solution Overview
Problem
In semiconductor devices with integrated IGBT and FWD elements, concentrated current flow leads to warpage in the heat dissipation plate, causing heat generation to be concentrated and limiting the increase in output current.
Innovation Solution
A semiconductor device design featuring a first and second conductor with divided pieces that extend in the arrangement direction, electrically connecting semiconductor elements to terminals, dispersing heat generation by distributing current flow and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a plurality of semiconductor elements are arranged side by side in a row between main terminals, then the output current can be increased, but current flow concentrates in the conductor causing warpage in the heat dissipation plate
Solution Approach 1:
The second conductor is divided into two divided pieces that are electrically connected to the plurality of semiconductor elements. This segmentation distributes the current flow path across multiple separate conductor segments, preventing current concentration in a single conductor and thereby preventing warpage in the heat dissipation plate while maintaining high output current capability
Solution Approach 2:
The divided pieces of the second conductor are positioned at different locations to connect to different semiconductor elements. This local distribution ensures that current flow is evenly distributed across the arrangement, with each divided piece carrying a portion of the total current, thus preventing localized heat concentration and warpage
2Power
If current flow concentrates in the arrangement direction of semiconductor elements, then heat generation is concentrated at specific portions, but this limits the increase in output current
Solution Approach 1:
By dividing the second conductor into multiple divided pieces connected to different semiconductor elements, the total current is segmented into multiple parallel current paths. This reduces the current density in each conductor segment and distributes heat generation across multiple locations, preventing thermal concentration that would limit output current increase
Solution Approach 2:
The divided pieces extend in the arrangement direction of the semiconductor elements, creating a two-dimensional current distribution pattern rather than a one-dimensional concentrated path. This spatial distribution across multiple dimensions effectively disperses heat generation while maintaining high current capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively disperses heat generation, preventing warpage and allowing for increased output current by distributing current flow across the semiconductor elements.
Implementation Method 1
a first conductor electrically connecting the first terminal and the plurality of semiconductor elements to each other; and a second conductor electrically connecting the plurality of semiconductor elements and the second terminal to each other
Data Source
AI summary
A semiconductor device includes first and second terminals, a first conductor having a plurality of semiconductor elements arranged side by side in an arrangement direction thereon, and electrically connecting the plurality of semiconductor elements to the first terminal via first wiring, and a second conductor electrically connecting the plurality of semiconductor elements on the first conductor to the second terminal via second wiring. The first and second terminals are respectively located on opposite sides of the first and second conductors with respect to the arrangement direction. The second conductor has a shoulder portion that extends in a width direction perpendicular to the arrangement direction and two extended portions arranged at the shoulder portion spaced apart from each other in the width direction. The two extended portions respectively extend in the arrangement direction and are electrically connected to the plurality of semiconductor elements.