Semiconductor Conductor Pattern Dicing Stability
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices face challenges in preventing conductor pattern pieces from being peeled off and flown off during the dicing process, leading to reduced yield and reliability due to the conductor patterns not being adequately secured, and attempts to downsize or widen the scribing region result in accuracy and stability issues.
Innovation Solution
A method involving the formation of multiple conductor patterns on a semiconductor substrate with specific widths and connections, where the dicing blade is narrower than the conductor patterns, allowing parts of these patterns to be left in the scribing region, enhancing their stability and preventing peeling off, while maintaining measurement accuracy and chip size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the width of the conductor pattern is narrowed to be smaller than the dicing blade width, then all conductor patterns can be removed during dicing, but the contacting area between inspection terminal and conductor pattern becomes small, deteriorating measurement accuracy
Solution Approach 1:
The conductor pattern is divided into two parts: a first conductor pattern in the chip region and a second conductor pattern in the scribing region. This segmentation allows each part to serve different functions - the first ensures measurement accuracy while the second prevents peeling during dicing
Solution Approach 2:
Different regions have different conductor pattern width requirements. The chip region maintains sufficient conductor width for accurate measurement, while the scribing region uses narrower conductor patterns that are removed during dicing, optimizing both measurement accuracy and peeling prevention locally
2Reliability
If the width of the scribing region is widened and a wide dicing blade is used to remove all conductor patterns, then conductor pattern peeling is prevented, but the chip size becomes larger and the number of chips acquired decreases
Solution Approach 1:
The harmful part (second conductor pattern in scribing region) is extracted and removed during the dicing process by using a dicing blade with width smaller than the conductor pattern, so it is not necessary to widen the scribing region or use wide dicing blades, thus maintaining high chip yield
Solution Approach 2:
The second conductor pattern is deliberately left in the scribing region with specific width characteristics that prevent peeling during dicing. This preliminary design prevents the harmful effect of peeling without requiring additional measures like widening the scribing region
3Reliability
If the conductor pattern width is reduced to match the dicing blade width, then all conductor patterns can be removed, but the conductor pattern piece is easily peeled off and may fly off as foreign matters
Solution Approach 1:
The conductor pattern is segmented into first and second parts with different width characteristics. The second conductor pattern in the scribing region has width greater than the dicing blade width, ensuring it remains attached during dicing and does not become foreign matter
Solution Approach 2:
The second conductor pattern acts as an intermediary element that facilitates the dicing process by providing a stable attachment point. Its specific width design ensures it remains anchored during cutting, preventing peeling and foreign matter contamination
Data Source
AI summary
A first conductor pattern is formed on a semiconductor substrate of a scribing region via an insulating film. A plurality of second conductor patterns connected to the first conductor pattern are formed on the first conductor pattern. A third conductor pattern connected to the plurality of second conductor patterns is formed on the plurality of second conductor pattern. The scribing region is cut off in a Y direction by using a dicing blade so that a part of the scribing region is left in a chip region. In an X direction, a width of the dicing blade is narrower than each width of the first and second conductor patterns. After cutting off the scribing region, a part of the first conductor pattern, all or a part of at least one of the plurality of second conductor patterns, and a part of the third conductor pattern are left in the scribing region.