Semiconductor Device Manufacturing via Conductor Transfer and Resin Sealing
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Solution Overview
Problem
Current semiconductor device manufacturing processes are complex and costly, requiring multiple steps and components, such as lead frames and bonding wires, which complicates the miniaturization and cost reduction of semiconductor devices.
Innovation Solution
A method involving flip-chip bonding of semiconductor chips to a support member with a conductor, followed by resin coating and removal of the support member to form a sealing structure, eliminating the need for grinding and reducing component count, allowing for simplified manufacturing and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional manufacturing methods with lead frames and bonding wires are used, then reliable electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates the lead frame and bonding wire components from the traditional semiconductor package structure. Instead of using separate lead frames and bonding wires for electrical connections, the invention integrates the electrical connection function directly into the molding compound through embedded conductive patterns, thereby reducing structural complexity while maintaining electrical connection reliability
Solution Approach 2:
The patent merges multiple functions into the molding compound: structural protection, electrical connection (through embedded conductors), and packaging. The molding compound simultaneously serves as the package body and contains the electrical interconnection structures, eliminating the need for separate lead frames and reducing overall device complexity
2Manufacturing precision
If traditional manufacturing processes with multiple steps are used, then manufacturing precision is maintained, but productivity decreases and manufacturing cost increases
Solution Approach 1:
The patent performs preliminary actions by pre-forming conductive patterns and structures within the molding compound before final assembly. The conductors are embedded and positioned in advance during the molding process, eliminating the need for subsequent grinding or precise alignment operations, thereby improving manufacturing efficiency without sacrificing connection precision
Solution Approach 2:
The molding compound serves multiple functions simultaneously: it provides structural protection, contains embedded conductors for electrical connections, and eliminates the need for separate packaging components. This multi-functionality reduces the number of manufacturing steps required while maintaining the precision needed for reliable electrical connections
3Reliability
If grinding step is added to expose electrodes, then electrical connection is achieved, but manufacturing process complexity and cost increase
Solution Approach 1:
Instead of forming electrodes first and then grinding away the molding compound to expose them, the patent inverts the sequence: conductors are embedded within the molding compound during the molding process itself, and the molding compound is cured to expose the electrodes naturally without requiring subsequent grinding operations
Solution Approach 2:
The molding compound acts as an intermediary that simultaneously protects the conductors during manufacturing and provides the exposure mechanism for electrodes. By controlling the curing and solidification process of the molding compound, the electrodes are naturally exposed at the appropriate positions without requiring additional grinding steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces costs, and enables miniaturization by eliminating the need for grinding and lead frames, while allowing for flexible external terminal placement, resulting in a more efficient and cost-effective semiconductor device production.
Implementation Method 1
fixing the semiconductor chip to the support member by bonding the electrode layer of the semiconductor chip to the conductor of the support member through a solder
Data Source
AI summary
The present invention provides a semiconductor device and a method for manufacturing a semiconductor device. The method comprises: Preparing a semiconductor chip 6 with a first electrode layer 21 formed on an element-forming surface 7. Prepared a support member 30 having a conductor 31 formed on a pattern-forming surface 33. The first electrode layer 21 is bonded to the conductor 31 by a solder, and thus the semiconductor chip 6 is fixed on the support member 30. While the semiconductor chip 6 is fixed on the support member 30, the semiconductor chip 6 is coated by the sealing resin 3 to form a sealing structure 46. By removing the support member 30 from the sealing structure 46, the conductor 31 formed on the support member 30 is transferred to the sealing structure 46. The conductor 31 transferred to the sealing structure 46 is an external electrode exposed from the sealing structure 46.