Semiconductor Connecting Clip with DCB Base and Copper Layer
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Solution Overview
Problem
Current semiconductor devices require multiple joining steps and materials like gold or aluminum wire bonding, which can be complex and prone to thermal stress, for connecting semiconductor chips to external contacts, limiting efficiency and reliability.
Innovation Solution
A semiconductor device design featuring a self-supporting connecting clip with a structured copper layer on a DCB material, which connects the chip's electrodes to external contacts via a single step, using a ceramic base with adapted thermal expansion and a conductive coating for high insulation and conductivity, eliminating the need for multiple bonding wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple joining steps and bonding wires are used to connect semiconductor chip to external contacts, then electrical connection is achieved, but process complexity and thermal stress increase
Solution Approach 1:
The patent combines multiple separate joining steps into a single hybrid bonding process. The bonding wire is integrated directly into the connection path between the semiconductor chip and external contacts, eliminating the need for separate wire bonding and lead frame attachment steps. This merging of functions reduces process complexity while maintaining connection reliability through a unified bonding interface.
Solution Approach 2:
The bonding wire serves multiple functions simultaneously: it provides electrical connection, mechanical support, and thermal management. The hybrid bonding structure integrates the wire into the lead frame assembly, making the wire serve both as an electrical conductor and as part of the mechanical mounting structure, thereby reducing the number of separate components needed.
2Reliability
If multiple joining steps are used to connect semiconductor chip to external contacts, then electrical connection is achieved, but thermal stress increases
Solution Approach 1:
The patent merges the wire bonding process with the lead frame attachment process into a single hybrid bonding step. This eliminates multiple thermal cycles that would otherwise be required for separate bonding operations, thereby reducing cumulative thermal stress on the semiconductor chip and its connections while achieving reliable electrical connectivity.
3Reliability
If conventional wire bonding is used to connect semiconductor chip to external contacts, then electrical connection is achieved, but contamination risks increase
Solution Approach 1:
The hybrid bonding approach combines wire bonding and lead frame attachment into a single integrated process step. This reduces the number of process transitions and handling operations, thereby minimizing opportunities for contamination to occur during assembly while maintaining reliable electrical connections through the integrated bonding structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process, reduces thermal stress, and enhances reliability by enabling efficient current conduction while minimizing contamination risks and process complexity, allowing for higher current handling and improved adhesion.
Implementation Method 1
a ceramic base with adapted thermal expansion
Implementation Method 2
a conductive coating for high insulation and conductivity
Data Source
AI summary
A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.