Semiconductor Package Connecting Plate for Chip Interconnection
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Solution Overview
Problem
Existing semiconductor packaging methods using lead wires for connecting multiple chips are prone to dislocation during bonding and soldering, leading to short circuits and performance issues due to the complexity and cost of assembly.
Innovation Solution
A semiconductor package and fabrication method utilizing a connecting plate with electrically isolated portions to securely position and connect multiple chips, where the connecting plate is divided into sections by tie bars that are electrically isolated after assembly, simplifying the assembly process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead wires are used to connect multiple chips, then the chips can be electrically connected, but the chips are prone to dislocation during bonding and soldering, resulting in short circuits
Solution Approach 1:
A connecting plate is introduced as an intermediary component between multiple chips and the lead frame. The connecting plate provides a stable mechanical support structure with positioning holes that securely hold the chips in place during bonding and soldering processes, preventing dislocation and short circuits while simplifying the overall assembly process
Solution Approach 2:
The connecting plate is divided into multiple electrically isolated portions, each portion being responsible for connecting to specific electrode contact areas of chips. This segmentation allows for simplified electrical connection paths and reduces the complexity of wire bonding while maintaining reliable electrical connectivity
2Reliability
If multiple chips are connected using lead wires, then electrical connection is achieved, but the assembly process becomes complex and costly
Solution Approach 1:
The connecting plate merges multiple functions into a single component: it provides mechanical support for multiple chips, establishes electrical connections through conductive portions, and offers positioning features through positioning holes. This consolidation replaces the need for separate wire bonding operations for each chip, significantly simplifying the manufacturing process and reducing costs
Solution Approach 2:
The connecting plate serves as a mediator that simplifies the connection architecture. Instead of requiring individual wire bonds from each chip to the lead frame, the connecting plate provides intermediate connection points that reduce the number of bonding operations required, making the assembly process easier and more cost-effective
Data Source
AI summary
A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding.