Semiconductor Module Connection Plate with Dielectric Holder
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Solution Overview
Problem
Existing semiconductor modules face issues with high mechanical stresses due to bending of thick metal plates for electrical connections, thermal expansion mismatches, and high stray inductances leading to potential damage and reduced insulation strength from air inclusions in encapsulation compounds.
Innovation Solution
An electrical connection module system featuring a connection plate with foot sections and a dielectric holder that securely holds a screw nut, allowing precise positioning and electrical insulation between connection plates, reducing mechanical stresses and air inclusions, and minimizing stray inductances through efficient encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick metal plates are used for electrical connections to achieve high current-carrying capacity, then the current-carrying capacity is improved, but the bending requires strong forces which can damage the module interior and cannot be carried out with desired precision
Solution Approach 1:
The connection plate is divided into a body portion and a connection end portion that can be separately formed and then assembled. The connection end is formed with a receiving region that captures the bent metal plate, allowing the bending operation to be performed on a smaller, more manageable component rather than the entire thick metal plate assembly.
Solution Approach 2:
The connection end of the connection plate is pre-formed with a receiving region designed to capture and hold the bent metal plate. This preliminary preparation of the receiving region enables precise and controlled bending of the metal plate connection end without requiring strong forces that would damage the module interior.
2Ease of manufacture
If pre-bent metal plates are injection-molded into the module housing during production, then the connection ends protrude out of the housing, but mechanical stresses occur due to different thermal expansion coefficients between metal plates and housing plastic
Solution Approach 1:
A receiving region is introduced as an intermediary structure between the metal plate connection end and the housing. This receiving region is formed in the connection plate itself and provides a capture mechanism that accommodates thermal expansion and contraction differences between the metal plate and plastic housing, preventing mechanical stresses while maintaining integration.
3Object-generated harmful factors
If two metal conductors are installed one after the other with small spacing and electrically insulated with encapsulation compound, then low inductance is achieved, but air inclusions in the encapsulation compound reduce insulation strength and may cause partial discharges
Solution Approach 1:
The problematic encapsulation compound filling process is replaced by extracting the harmful element (air inclusions) from the system. The invention uses a receiving region with a capture structure that physically traps and holds the metal plate connection end in place, eliminating the need for encapsulation compound and thereby preventing air inclusions that would reduce insulation strength.
Data Source
AI summary
An electrical connection module system includes a first connection plate with a first connection end and at least one first foot section, a first screw nut, and a dielectric holder. The dielectric holder has a first reception region for receiving the first screw nut. The first connection plate can, when the first screw nut is placed in the first reception region, be pushed onto the dielectric holder and be brought into a first target position such that the first screw nut is arranged between the dielectric holder and the first connection end and is held by the first connection end in the first reception region in such a way that the first screw nut cannot fall out.