Semiconductor Connector with Tilted Side Surface for Heat Dissipation
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Solution Overview
Problem
The existing connection structures between the chip and outer leads in semiconductor devices, particularly when the package upper surface is exposed, face issues related to heat dissipation and reliability due to the risk of resin detachment and moisture penetration, which can lead to decreased performance and reliability.
Innovation Solution
A semiconductor device design featuring a connector with a thicker first portion and a thinner second portion, where the first portion is bonded to the semiconductor chip and exposed for heat dissipation, and the second portion protrudes towards the second leadframe, with a resin-sealed structure that includes tilted side surfaces and protruding portions to enhance heat dissipation and prevent resin detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the package upper surface is exposed for heat dissipation, then heat dissipation efficiency is improved, but the risk of resin detachment and moisture penetration increases
Solution Approach 1:
The connector is designed with a tilted side surface that creates a stepped configuration, transitioning from a single-plane exposure to a multi-dimensional structure. The first surface is exposed for heat dissipation while the tilted side surface allows resin to overlap and seal the edges, preventing moisture penetration while maintaining thermal performance.
Solution Approach 2:
The connector combines different materials with complementary properties: a high-thermal-conductivity material (such as copper or aluminum) for the heat dissipation surfaces, and a tilted side surface configuration that works with the resin sealing material to prevent moisture ingress while maintaining structural integrity.
2Temperature
If the package upper surface is exposed for heat dissipation, then heat dissipation efficiency is improved, but moisture penetration risk increases
Solution Approach 1:
The tilted side surface creates a stepped, multi-dimensional structure that allows resin to overlap the edges of the exposed first surface. This geometric configuration forms a protective barrier that prevents moisture from reaching the connector-chip interface while preserving the heat dissipation function of the exposed surface.
Solution Approach 2:
The resin acts as an intermediary sealing material that fills the space created by the tilted side surface configuration. The resin overlaps the edges of the connector's exposed surfaces, creating a moisture barrier that protects the internal interfaces while allowing the connector to maintain its heat dissipation function.
3Reliability
If a connector is used to reduce resistance, then electrical connection performance is improved, but structural complexity increases
Solution Approach 1:
The connector serves multiple functions simultaneously: it provides low-resistance electrical connection between the chip and leadframes, acts as a heat dissipation structure with exposed surfaces, and creates a geometric configuration that enables resin sealing against moisture. This multi-functionality reduces the need for separate components and simplifies the overall device structure.
Solution Approach 2:
The connector merges the electrical connection function, heat dissipation function, and moisture sealing support function into a single integrated component. The tilted side surface configuration combines the electrical conduction path with the geometric feature needed for resin sealing, eliminating the need for separate sealing structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves effective heat dissipation and increased reliability by utilizing a double-sided cooling package structure with high heat dissipation efficiency, reducing the risk of resin detachment and moisture penetration, thereby enhancing the overall performance and longevity of the semiconductor device.
Implementation Method 1
heat dissipation occurs from both the package lower surface on the mounting substrate side and the package upper surface
Implementation Method 2
heat dissipation occurs from both the package lower surface on the mounting substrate side and the package upper surface
Implementation Method 3
The side surface is tilted with respect to the bonding surface and the heat dissipation surface, and covered with the resin
Data Source
AI summary
According to one embodiment, the connector includes a first portion and a second portion. The first portion is provided on the second surface of the semiconductor chip and bonded to the second electrode. The first portion has a bonding surface, a heat dissipation surface, and a side surface. The bonding surface is bonded to the second electrode of the semiconductor chip. The heat dissipation surface is opposite to the bonding surface and exposed from the resin. The side surface is tilted with respect to the bonding surface and the heat dissipation surface, and covered with the resin. The second portion protrudes from the first portion toward the second leadframe side. The second portion is thinner than the first portion and bonded to the second leadframe.