Semiconductor Contact Clip Height for Heat Sink Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inadequate heat dissipation in semiconductor devices, particularly vertical power semiconductor components, due to limited surface area for mounting additional heat sinks, which can lead to instability and failure.
Innovation Solution
The semiconductor device incorporates a design with first and second contact clips, where the upper surface of the first contact clip is positioned further away from the top side of the semiconductor component than the second contact clip, allowing for the mounting of a larger heat sink without short circuits, and utilizing a plastic housing to provide insulation and simplify heat sink attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact elements are arranged on both top side and underside of semiconductor component, then electrical connection is achieved, but free surface area for heat sink mounting is reduced
Solution Approach 1:
The patent utilizes the vertical dimension by arranging contact clips at different heights above the semiconductor component. The first contact clip is positioned higher than the second contact clip, creating a stepped configuration that provides mounting surface area in the vertical direction while maintaining all necessary electrical connections on the limited horizontal surface area.
2Temperature
If additional heat sink is mounted on semiconductor component, then heat dissipation is improved, but short circuits may occur between heat sink and contact elements
Solution Approach 1:
By positioning the first contact clip at a higher vertical level than the second contact clip, the patent creates a stepped arrangement where the heat sink can be mounted on the upper surface without contacting the lower-positioned second contact clip. This vertical separation eliminates short circuit risk while maintaining effective thermal contact.
Solution Approach 2:
The first contact clip serves as an intermediary structure that provides a mounting platform for the heat sink. Its elevated position acts as a mediator between the heat sink and the lower contact elements, allowing thermal conduction while preventing electrical contact between the heat sink and the second contact clip.
3Ease of manufacture
If contact clips are arranged at the same level, then manufacturing is simplified, but heat sink mounting area is limited
Solution Approach 1:
The patent extends the problem from two-dimensional planar arrangement to three-dimensional spatial arrangement by positioning contact clips at different vertical heights. This allows the heat sink to be mounted on the upper surface created by the elevated first contact clip, effectively utilizing the vertical dimension to increase mounting area without complicating the basic contact clip structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation by creating a larger cooling area without affecting the device's functionality, simplifies heat sink mounting, and reduces the risk of short circuits, thereby improving the stability and performance of semiconductor devices.
Implementation Method 1
an additional heat sink can be arranged on the device housing or directly on the semiconductor component in order to distribute the heat better
Implementation Method 2
utilizing a plastic housing to provide insulation and simplify heat sink attachment
Data Source
AI summary
A semiconductor device (1) has a semiconductor component (2), a first electrode (6) and a control electrode (7) being arranged on the top side (4). The semiconductor device (1) furthermore has a circuit carrier (3) having a chip island (9) and a plurality of flat conductors (10). The rear side (5) of the semiconductor component (2) is mounted on the chip island (9). The first electrode (6) is electrically connected to a first flat conductor (13) via a first contact clip (16) and the control electrode (7) is electrically connected to a control flat conductor (14) via the second contact clip (19). The upper surface (33) of the first contact clip (16) is at least partly arranged in a plane which is further away from the top side (4) of the semiconductor component (2) than the entire upper surface (34) of the second contact clip (19).