Semiconductor Contact Clip Protrusions for Reliable Bonding
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Solution Overview
Problem
The cost-intensive process of packaging semiconductor chips, particularly in forming reliable electrical connections between semiconductor chips and leadframes, remains a challenge in semiconductor device manufacturing, as existing methods like wire bonding and soldering can be inefficient and prone to mechanical stress.
Innovation Solution
The use of contact clips with protrusions extending from contact areas, which are soldered to both the semiconductor chip and leadframe using a diffusion soldering process, creating a stable and high-temperature-resistant intermetallic phase for secure electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding or soldering is used to electrically couple semiconductor chips to leadframe, then electrical connection is established, but the process is cost-intensive and prone to mechanical stress
Solution Approach 1:
The patent extracts the bonding pads from the semiconductor chip surface and integrates them directly into the leadframe structure. The leadframe itself serves as both the mechanical support and the electrical connection element, eliminating the need for separate wire bonding or soldering processes. This integration reduces manufacturing steps and costs while improving reliability.
Solution Approach 2:
The patent merges the functions of the leadframe and the bonding pads into a single integrated structure. The leadframe is designed to directly contact the semiconductor chip electrodes without requiring additional connection elements, combining mechanical support and electrical coupling functions into one component.
2Strength
If conventional soldering is used to attach contact clip to semiconductor chip and leadframe, then electrical coupling is achieved, but the connection is susceptible to mechanical stress and high temperature damage
Solution Approach 1:
The patent changes the material parameters of the contact clip by using an intermetallic phase material with superior mechanical and thermal properties compared to conventional solder. The intermetallic phase exhibits higher strength, better creep resistance, and improved thermal stability, allowing the connection to withstand mechanical stress and high temperatures without degradation.
Solution Approach 2:
The patent employs composite material structure where the contact clip is formed with an intermetallic phase that combines the benefits of different metals. This intermetallic composite provides enhanced mechanical strength and thermal resistance while maintaining good electrical conductivity and bonding characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and durability of electrical connections, allowing the semiconductor device to withstand high temperatures and mechanical stress while reducing manufacturing costs by ensuring strong, stable intermetallic phases between the contact clip, leadframe, and semiconductor chip.
Implementation Method 1
The contact areas are soldered to the first lead and the first electrode, respectively, such that a stable and high-temperature-resistant intermetallic phase is formed.
Data Source
AI summary
A semiconductor device includes a leadframe with a die pad and a first lead, a semiconductor chip with a first electrode, and a contact clip with a first contact area and a second contact area. The semiconductor chip is placed over the die pad. The first contact area is placed over the first lead and the second contact area is placed over the first electrode of the semiconductor chip. A plurality of protrusions extends from each of the first and second contact areas and each of the protrusions has a height of at least 5 μm.