Semiconductor Device Embedded in Contact Lens

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Solution Overview

Problem

Conventional semiconductor devices embedded in contact lenses are large, uncomfortable, and visually obstructive, and they expose wearers to potentially harmful RF radiation due to their reliance on external RF power sources.

Innovation Solution

A self-contained semiconductor device is integrated into a contact lens, featuring a sensor, processing circuit, power supply, and antenna on a single unpackaged die, which detects analytes in tears, generates a signal, and transmits data using a millimeter-wave antenna, powered by a high-efficiency solar cell with a capacitor boost circuit, eliminating the need for solder connections and external RF power.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If discrete components are used with individual packages and solder connections, then the device can be assembled using conventional methods, but the device size becomes large and requires a thicker contact lens

Engineering Contradiction:
Improveconventional assembly methodsVSAvoiddevice size
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent integrates the sensor, processing circuit, power supply, and antenna onto a single substrate, eliminating the need for multiple discrete components and their individual packages. This consolidation dramatically reduces the overall device volume while maintaining functionality, allowing the contact lens to remain thin and comfortable for wear.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If discrete components are mounted on a substrate with solder connections, then the device can be electrically coupled together, but the device size increases and may obstruct the wearer's field of vision

Engineering Contradiction:
Improveelectrical couplingVSAvoiddevice area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

All electrical components are integrated onto a single substrate with interconnections formed directly on the substrate, eliminating the need for separate solder connections between discrete components. This reduces the device area significantly, preventing obstruction of the wearer's field of vision while maintaining reliable electrical coupling.

Inventive Principle:
Principle #5Merging (Combining)

3Use of energy by moving object

If RFID antenna is used to receive RF power, then the device can be powered wirelessly, but the wearer is subjected to inbound RF radiation that may impair health

Engineering Contradiction:
Improvewireless powerVSAvoidRF radiation exposure
Core Design Contradiction:
Use of energy by moving objectVSObject-affected harmful factors

Solution Approach 1:

Instead of using an RFID antenna to receive RF power from external sources (which exposes the wearer to harmful inbound RF radiation), the patent inverts the approach by using a power supply and capacitor circuit to generate and transmit RF signals outward from the device. This allows wireless communication and data transmission without subjecting the wearer to harmful RF radiation.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts and eliminates the RFID receiving antenna that would be required for wireless power transfer, replacing it with a local power supply system. This removal of the RFID antenna eliminates the need for the wearer to be exposed to inbound RF radiation while maintaining the ability to transmit data wirelessly.

Inventive Principle:
Principle #2Taking out (Extraction)

4Adaptability or versatility

If multiple discrete components are used, then the device can perform multiple functions, but the device complexity increases and requires more space

Engineering Contradiction:
Improvemulti-functionalityVSAvoidnumber of components
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines the sensor, processing circuit, power supply, and antenna into an integrated device structure on a single substrate. This merging of multiple functional components into one unified device reduces the overall number of separate components, simplifying the device while maintaining multi-functionality for analyte detection, signal processing, power management, and wireless communication.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the device's size, enhances wearer comfort, avoids visual obstruction, and minimizes health risks by transmitting data outward from the lens without exposing the wearer to inbound RF radiation, while maintaining effective analyte monitoring capabilities.

Implementation Method 1

A power supply may be coupled to the processing circuit to provide direct current (DC) power to the processing circuit

Methodology Applied
Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Implementation Method 2

A boost circuit may be coupled to the power supply, whereby the boost circuit increases the provided DC power to the processing circuit

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 3

An antenna may be coupled to the processing circuit for transmitting the generated signal

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS9687181B2Semiconductor device to be embedded within a contact lens
Publication Date: 2017.06.27 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US9687181B2 patent drawing
  • US9687181B2 patent drawing
  • US9687181B2 patent drawing

AI summary

A semiconductor device embedded within a contact lens is provided. The semiconductor device may include a sensor that determines one or more properties associated with an analyte within fluid surrounding the contact lens, and a processing circuit that is coupled to the sensor. The processing circuit generates a signal associated with the one or more determined properties associated with the analyte. A power supply is coupled to the processing circuit for providing DC power to the processing circuit. A boost circuit coupled to the power supply may then increase the provided DC power of the power supply for transmitting the signal generated by the processing circuit. An antenna is coupled to the processing circuit for transmitting the generated signal, whereby the sensor, the processing circuit, the power supply, the boost circuit, and the antenna are contained on a single unpackaged semiconductor die.