Semiconductor Contact Region Ring Segmentation for Current Uniformity
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Solution Overview
Problem
Current semiconductor light-emitting devices face challenges in achieving uniform current distribution and improved luminous efficiency due to limitations in contact region design, which can lead to electrical failures and reduced performance.
Innovation Solution
The semiconductor device incorporates a contact region with multiple concentric ring-shaped groups of contact portions, each with varying distances from the geometric center, optimizing the distribution of current and reducing the risk of electrical failure by ensuring uniform current dispersal across the epitaxial structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional contact region design is used, then the device structure is simple, but the current distribution is non-uniform and luminous efficiency is reduced
Solution Approach 1:
The contact region is segmented into multiple groups of contact portions (first group, second group, third group) arranged in different patterns (linear, ring-shaped, irregular). This segmentation allows current to be distributed through multiple separate pathways rather than a single concentrated path, achieving uniform current distribution across the epitaxial structure while maintaining manufacturing feasibility through standardized patterning processes.
2Reliability
If contact portions are concentrated in one area, then the manufacturing process is simple, but electrical failure risk increases due to non-uniform current dispersal
Solution Approach 1:
Different groups of contact portions are designed with different local characteristics: the first group has linearly arranged contact portions for primary current injection, the second group has ring-shaped contact portions for lateral current distribution, and the third group has irregularly arranged contact portions for edge current management. This local quality variation optimizes current dispersal at different locations while using standard semiconductor fabrication techniques to maintain ease of manufacture.
Data Source
AI summary
A semiconductor device is provided, which includes an epitaxial structure, an electrode pad, and a contact region. The epitaxial structure includes a geometric center, a first surface and a second surface opposite to the first surface. The electrode pad is on the first surface. The contact region is on the second surface and includes a first group and a second group. The first group includes a plurality of first contact portions separated from each other and is arranged in a first ring shape. The second group includes a plurality of second contact portions separated from each other and is arranged in a second ring shape. A second distance between each of the plurality of second contact portions and the geometric center is greater than a first distance between each of the plurality of first contact portions and the geometric center.