Semiconductor Contact Area Connection via Insulation Trenches
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Solution Overview
Problem
Existing methods for connecting through contacts on semiconductor components are complex and require closing insulation trenches, which can be challenging and costly, especially when integrating multiple components vertically.
Innovation Solution
A method that connects a first through contact area to a second contact area on a substrate by forming insulation trenches, applying metal layers, and creating printed conductors between them, allowing for flexible placement of the second contact area without necessarily closing the insulation trenches, using dielectric or diffusion barrier layers for additional stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation trenches are closed to connect through contacts, then connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the requirement to close insulation trenches from the manufacturing process. Instead of filling and closing the trenches, the method allows them to remain open while achieving reliable electrical connection through alternative means (conductive structures that bridge across the open trenches), thereby reducing manufacturing complexity while maintaining connection reliability
Solution Approach 2:
The patent inverts the conventional approach by not closing the insulation trenches but rather designing the conductive connection structures to span across the open trenches. This inversion eliminates the complex trench-closing steps while achieving the same electrical connection function, reducing manufacturing complexity without sacrificing reliability
2Area of stationary object
If multiple components are placed vertically one on top of another, then space utilization is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the vertical stack into independently manufacturable layers that are subsequently bonded together. Each layer can be manufactured with standard precision requirements, and the segmentation allows for modular assembly, reducing the overall manufacturing precision requirements compared to creating a single monolithic multi-layer structure
Solution Approach 2:
The patent performs preliminary manufacturing of individual layers with their contact structures before final assembly. The contact areas and conductive structures are pre-formed on each layer, allowing for easier alignment during bonding. This preliminary preparation reduces the precision requirements during the final vertical stacking process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the connection process, allows for flexible placement of contact areas, reduces complexity and cost, and enables efficient wiring without high-temperature steps, making it suitable for temperature-sensitive processes and enabling the production of substrates with interconnected semiconductor components.
Implementation Method 1
applying at least one metal layer to the insulation layer
Data Source
AI summary
A method for providing and connecting a first contact area to at least one second contact area on a substrate, in particular in the case of a semiconductor component, which includes providing at least one insulation layer on the substrate, forming an opening in the at least one insulation layer over at least one insulation trench of a first contact area, applying at least one metal layer to the insulation layer, forming the first and second contact areas in the at least one metal layer and at least one printed conductor between the two contact areas, and forming the insulation trench.