Semiconductor Device Control Signal Terminal Footprint Reduction
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Solution Overview
Problem
Conventional semiconductor devices with power modules experience increased footprint due to the placement of control signal terminals outside the power semiconductor elements, leading to potential wire disconnection from vibration and thermal fatigue, and existing solutions do not effectively minimize the device size while ensuring accurate positional alignment.
Innovation Solution
A semiconductor device design where the control signal terminal is inserted into an insulating block surrounding the power semiconductor element, with a bent portion protruding to be directly bonded to the element, reducing the footprint and enhancing structural integrity against vibration and thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If control signal terminals are arranged around the power semiconductor element and connected by wire bonding, then electrical connection is achieved, but the footprint increases and wire disconnection risk occurs due to vibration and thermal fatigue
Solution Approach 1:
The control signal terminal is merged with the main terminal structure, both being bonded directly to the power semiconductor element. This integration eliminates the need for separate wire bonding connections and reduces the overall footprint while improving reliability through direct bonding.
Solution Approach 2:
The control signal terminal extends in the thickness direction (vertical dimension) to cross the main surface of the power semiconductor element, rather than being arranged in the planar direction. This dimensional change allows the terminal to connect directly to the control signal pad without requiring additional lateral space, thereby reducing footprint while maintaining connection reliability.
2Area of stationary object
If control signal terminal extends along thickness direction crossing main surface, then footprint is reduced, but positioning accuracy relative to control signal pad becomes difficult to ensure
Solution Approach 1:
The control signal terminal is positioned in advance during the molding process, with its projection preliminarily aligned with the control signal pad before bonding. This preliminary positioning ensures accurate alignment is achieved without requiring complex adjustment mechanisms, maintaining manufacturing precision while benefiting from the reduced footprint design.
3Area of stationary object
If control signal terminal is bonded directly to power semiconductor element, then footprint is minimized, but bonding quality evaluation becomes more difficult
Solution Approach 1:
A resin layer with different visual characteristics is provided over the control signal terminal, creating a visual contrast that allows bonding quality to be evaluated. The resin layer's appearance changes or differs from surrounding materials, enabling inspectors to detect bonding defects through visual inspection or automated optical inspection systems.
Data Source
AI summary
Provided are a semiconductor device which is provided with a circuit board and capable of suppressing an increase in its footprint, and a power conversion apparatus including the semiconductor device. The semiconductor device includes a circuit board, a power semiconductor element, an insulating block, a control signal terminal, a first main terminal, and a second main terminal. The insulating block is disposed so as to surround the power semiconductor element. The control signal terminal is inserted into the insulating block and thereby fixed to the insulating block. The control signal terminal includes a bent portion which partially protrudes above the power semiconductor element from the insulating block, and is bonded to the power semiconductor element. The first main terminal is bonded to the same power semiconductor element as the power semiconductor element to which the control signal terminal is bonded. The second main terminal is bonded to the circuit board.