Semiconductor Control Terminal Support Mechanism
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Solution Overview
Problem
Power semiconductor devices, particularly intelligent power modules (IPMs), face challenges in preventing control terminals from bending when an external connector is fitted, due to stress application, which can lead to protrusion issues and reduced phase-to-phase insulating distances.
Innovation Solution
Incorporating a support mechanism within the semiconductor device, such as a protruding support from the case or lid, to stabilize the control terminals' bends, thereby preventing bending and ensuring secure fitting of the external connector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If control terminals are formed linearly from the control substrate perpendicular to the substrate surface, then the control terminals are less likely to be bent by stress during connector fitting, but the locations of protrusions are limited due to phase-to-phase insulating distance requirements
Solution Approach 1:
The control terminal is divided into multiple segments: a linear portion extending perpendicular to the substrate surface, a bend portion, and a protrusion portion. This segmentation allows the terminal to maintain structural integrity during connector fitting while enabling flexible positioning of the protrusion at various locations relative to the module.
Solution Approach 2:
The control terminal transitions from a purely linear configuration to a three-dimensional structure with bends at specific angles. This dimensional change enables the protrusion to emerge from locations that would otherwise be inaccessible due to insulating distance constraints, while the linear portion near the substrate maintains stress resistance.
2Reliability
If a protrusion is added to the control terminal to relieve stress during connector fitting, then stress transmission to the insulating substrate is reduced, but the protrusion may be caught by the lid to prevent the control terminal from returning to its original location
Solution Approach 1:
A support structure is provided within the module that beforehand cushions and supports the control terminal at its bend location. This prevents the terminal from being pushed too far inward when stress is applied during connector fitting, ensuring the terminal can return to its original position after stress removal.
Solution Approach 2:
The support structure acts as an intermediary between the control terminal and the lid. It provides a controlled interaction point that allows stress relief while preventing the terminal from being caught by the lid, thereby maintaining position stability.
3Ease of operation
If the control terminal is pushed into the module by excessive stress during connector fitting, then the protrusion may be caught by the lid, but this prevents the control terminal from returning to its original location and causes bending
Solution Approach 1:
The support structure is positioned beforehand to cushion the control terminal at the bend location, preventing excessive inward movement during connector fitting. This ensures the terminal remains within acceptable displacement limits and can return to its original position after stress removal.
Solution Approach 2:
The support structure provides preliminary anti-action by opposing the inward push force on the control terminal before the terminal can be pushed too far into the module. This prevents the protrusion from being caught by the lid and ensures the terminal maintains its position stability.
Data Source
AI summary
A semiconductor device includes: a case having an opening; a semiconductor element contained in the case; a control substrate which is disposed above the semiconductor element in the case and on which a control circuit to control the semiconductor element is disposed; a lid to cover the opening of the case; and a control terminal having one end portion connected to the control circuit disposed on the control substrate and the other end portion protruding out of the case. The control terminal has a bend in the case, and a side portion of the case or the lid is provided with a support capable of supporting the bend.