Semiconductor Module Control Wiring Layout for Heat-Cycle Disconnection
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Solution Overview
Problem
The disconnection of control wiring in semiconductor modules due to heat cycling leads to operational instability and potential destruction of the apparatus, as the thin bonding wires used for control wiring are prone to failure.
Innovation Solution
A dual auxiliary wiring system is implemented, with one auxiliary wiring connected close to the semiconductor device and another spaced apart, allowing for early detection of disconnection by timing differences in switching operations, thereby preventing immediate destruction and ensuring stable operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a thin bonding wire is used for control wiring to reduce current flow, then current consumption is reduced, but the wiring becomes prone to deterioration and disconnection due to heat cycling
Solution Approach 1:
The patent applies preliminary action by providing a second auxiliary wiring as a backup before the first auxiliary wiring fails. The control circuit is configured to detect disconnection of the first auxiliary wiring and switch to using the second auxiliary wiring, preventing operational failure before it occurs. This proactive approach ensures continuous operation by having a ready standby path.
Solution Approach 2:
The patent implements beforehand cushioning by creating a redundant wiring path with the second auxiliary wiring that serves as a protective buffer against the failure of the first auxiliary wiring. This redundancy acts as a cushion that absorbs the impact of potential wire deterioration and disconnection, maintaining system reliability even when one wiring path fails.
2Length of stationary object
If control wiring is connected close to the semiconductor device to reduce path length, then connection reliability is improved, but the wiring is more exposed to heat and prone to deterioration
Solution Approach 1:
The patent applies segmentation by dividing the auxiliary wiring function into two separate wirings (first and second auxiliary wirings) with different configurations. The first auxiliary wiring connects close to the semiconductor device for short path length, while the second auxiliary wiring connects at a distance for heat resistance. This segmentation allows each wiring to optimize for its specific function.
Solution Approach 2:
The patent implements local quality by creating different wiring paths with different characteristics - the first auxiliary wiring has short path length optimized for signal integrity, while the second auxiliary wiring has longer path length optimized for heat resistance. Each wiring path is locally optimized for its specific role in the redundant system.
3Device complexity
If a single auxiliary wiring is used to maintain reference potential, then device complexity is reduced, but disconnection cannot be detected early and leads to operational failure
Solution Approach 1:
The patent applies feedback by configuring the control circuit to continuously monitor the connection status of the first auxiliary wiring and automatically switch to the second auxiliary wiring when disconnection is detected. This feedback mechanism enables early detection of wiring failures and automatic correction, maintaining reliable operation without significant complexity increase.
Data Source
AI summary
A semiconductor module includes a laminate substrate having a first circuit board on which a semiconductor device having a plurality of upper surface electrodes including at least a main electrode is disposed and a second circuit board, a main terminal electrically connected to the main electrode, first and second auxiliary terminals electrically connected to first and second surface electrodes, and a main current wiring member electrically connecting the main electrode to the main terminal. A first path through which a first control current flows via the first auxiliary wiring is provided between the first upper surface electrode and the second auxiliary terminal, and a second path through which a second control current flows, via the main current wiring member, the second circuit board, and the second auxiliary wiring in this order, is provided between the second upper surface electrode and the second auxiliary terminal.