Semiconductor Device Convex Housing Thermal Stress Reduction
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Solution Overview
Problem
Conventional power modules face issues such as shortened lifespan due to thermal stress on bonding portions between semiconductor elements and wires, increased manufacturing costs and complexity, and decreased productivity due to the need for extensive adhesive application and silicone gel sealing, as well as difficulties in terminal insertion and sealing structures.
Innovation Solution
A semiconductor device with a housing made of thermoplastic resin and a core portion sealed with mold resin, featuring a convex surface that reduces thermal stress and contact resistance, allowing for improved engagement and reduced manufacturing steps, thereby enhancing lifespan and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied to substrate or casing and hardened to bond substrate and casing, then bonding strength is improved, but number of processes increases and productivity decreases
Solution Approach 1:
The patent combines the bonding function and sealing function into a single integrated structure. The housing directly bonds the substrate and casing together while also providing the sealing function, eliminating the need for separate adhesive application and silicone gel sealing processes. This merging of functions reduces the number of manufacturing steps and improves productivity while maintaining bonding strength.
2Reliability
If adhesive is applied to entire periphery of substrate without gap to prevent silicone gel leakage, then sealing reliability is improved, but time and effort increase and productivity decreases
Solution Approach 1:
The patent extracts the sealing function from the adhesive bonding process and integrates it into the housing structure itself. The housing is designed with features that provide both mechanical bonding and sealing functions simultaneously, eliminating the need for extensive adhesive application around the entire substrate periphery. This reduces manufacturing complexity while maintaining sealing reliability.
3Reliability
If protruding portion is inserted into opening to ensure sealing properties, then sealing reliability is improved, but ease of insertion decreases and productivity decreases
Solution Approach 1:
The patent applies a curved or tapered surface design to the insertion interface between the core portion and housing. The side surface of the core portion is formed with a curved shape that facilitates smooth insertion into the housing while maintaining reliable sealing contact. This curvature reduces friction and guides the insertion process, improving ease of operation without compromising sealing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor device achieves extended lifespan by minimizing thermal stress and contact resistance, while simplifying the manufacturing process and reducing costs through the use of mold resin and convex surface design, leading to improved engagement and stability within the housing.
Implementation Method 1
thermal stress caused by thermal expansion and thermal contraction
Implementation Method 2
thermal stress caused by thermal expansion and thermal contraction
Implementation Method 3
contact resistance
Data Source
AI summary
A semiconductor device includes a housing made of a thermoplastic resin and having an internal space that is opened on one side and an inner wall portion that has an inner peripheral surface defining the internal space; and a core portion engaged in the internal space of the housing. The core portion includes a substrate, a semiconductor element mounted on the substrate, a wire electrically connecting the substrate and the semiconductor element, and a mold resin sealing the substrate, the semiconductor element and the wire. The core portion has a side surface provided with a convex portion that is in contact with the inner peripheral surface of the inner wall portion. Accordingly, a semiconductor device allowing a lengthened life and improved productivity, and a method of manufacturing the semiconductor device can be provided.