Semiconductor Cooler Aperture Layout for Uniform Coolant Flow

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Solution Overview

Problem

Existing liquid-cooled coolers for semiconductor modules often experience unbalanced coolant flow distribution, leading to uneven cooling efficiency and potential overheating, which can result in performance degradation or failure, and are prone to increased pressure loss due to complex configurations or large dimensions.

Innovation Solution

A cooler design featuring a container with first and second flow rate adjusting members, each with specific aperture ratios and slit configurations, to regulate coolant flow between parallel flow paths, ensuring uniform distribution and minimizing pressure loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If coolant flow paths are formed in gaps between heat dissipating fins, then cooling efficiency is improved, but flow distribution becomes unbalanced and pressure loss increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidpressure loss
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent applies local quality by varying the aperture ratios of flow rate adjusting members at different positions along the flow paths. The first flow rate adjusting member has a first aperture ratio in a first region and a second aperture ratio in a second region, while the second flow rate adjusting member has a third aperture ratio in a third region and a fourth aperture ratio in a fourth region. This spatial variation in aperture ratios optimizes coolant distribution locally to achieve balanced flow across all heat dissipating fins, preventing both insufficient cooling and excessive pressure loss.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If flow rate adjusting members with multiple aperture ratios are used, then flow distribution uniformity is improved, but device complexity increases

Engineering Contradiction:
Improveflow distribution uniformityVSAvoidstructure complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent segments the flow rate adjusting members into multiple regions with different aperture ratios. The first flow rate adjusting member is divided into a first region and a second region, while the second flow rate adjusting member is divided into a third region and a fourth region. Each region is positioned to control coolant flow to specific heat dissipating fins, allowing precise flow distribution control through segmented aperture design rather than using a single complex adjustable mechanism.

Inventive Principle:
Principle #1Segmentation

3Productivity

If aperture ratios are optimized for flow distribution, then cooling performance is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvecooling performanceVSAvoidaperture ratio precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent optimizes cooling performance by establishing specific relationships between aperture ratios: the first aperture ratio is larger than the second aperture ratio, and the third aperture ratio is larger than the fourth aperture ratio. These parameter changes create a progressive aperture reduction pattern that compensates for pressure drop along the flow paths, ensuring uniform coolant distribution to heat dissipating fins while maintaining manufacturable aperture dimensions through systematic parameter variation rather than requiring ultra-precise individual aperture control.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves a uniform coolant flow distribution and reduces pressure loss, maintaining efficient cooling while preventing overheating and minimizing the complexity and size of the cooler system.

Implementation Method 1

a first flow rate adjusting member disposed inside the container between the first flow path and the third flow path; and a second flow rate adjusting member disposed inside the container between the second flow path and the third flow path, wherein the first flow rate adjusting member includes a first region and a second region, and has one or more openings through which the coolant flows from the first flow path to the third flow path

Methodology Applied
Scientific EffectFluid flow regulation through aperture control:

Implementation Method 2

a heat dissipating plate that has a semiconductor element bonded to its outer surface and covers an opening in the cooling jacket

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 3

a container that includes a first side wall having an inlet for a coolant and a second side wall having an outlet for the coolant

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20240379499A1Cooler and semiconductor device
Publication Date: 2024.11.14 FUJI ELECTRIC CO LTD
  • US20240379499A1 patent drawing
  • US20240379499A1 patent drawing
  • US20240379499A1 patent drawing

AI summary

A cooler includes first and second flow paths inside a container, respectively communicating with an inlet and an outlet, a third flow path, and first and second flow rate adjusting members respectively disposed between the first and third flow paths, and the second and third flow paths. The first flow rate adjusting member includes one or more openings through which a coolant flows from the first flow path to the third flow path, and has a first region with a first open area ratio and a second region with a second open area ratio less than the first one. The second flow rate adjusting member includes one or more openings through which the coolant flows from the third flow path to the second flow path, and has a third region with a third area ratio and a fourth region with a fourth open area ratio greater than the third one.