Semiconductor Module Cooler Bolt Fixing Mechanism
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Solution Overview
Problem
Conventional semiconductor devices have dead spaces due to the structure of fixing portions, leading to increased size and inefficiency, as seen in existing semiconductor devices that are thread-fastened or have protrusions for screwing, resulting in unused space for electric conduction.
Innovation Solution
A semiconductor device design where the semiconductor module and cooler are bonded using a bolt with specific through-holes and insulation layers, eliminating the need for additional fixing bolts and reducing the device's width by integrating the fixing mechanism into the existing conductive terminals and cooler structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the semiconductor module and cooler are fixed with separate fixing bolts through dedicated fixing holes, then the bonding strength between semiconductor module and cooler is improved, but the device width increases due to dead spaces occupied by the fixing structure
Solution Approach 1:
The patent merges the fixing function with the external conductive terminal structure. The external conductive terminal is designed with a through-hole that serves dual purposes: electrical conduction and mechanical fastening. The fixing bolt passes through the same hole used for electrical connection, eliminating the need for separate fixing holes and reducing dead spaces that increase device width.
Solution Approach 2:
The external conductive terminal structure is given multiple functions: it provides electrical conduction between the semiconductor module and external circuitry, and simultaneously serves as a mounting structure for mechanical fastening. The through-hole in the external conductive terminal is used both for passing electrical signals and for passing the fixing bolt, making the structure universal and eliminating wasted space.
2Reliability
If dedicated fixing holes are provided for mounting the cooler, then the reliability of the cooler mounting is improved, but dead spaces are created that increase the overall device size
Solution Approach 1:
The patent combines the cooler mounting function with the existing external conductive terminal structure. Instead of creating separate fixing holes in the resin frame, the fixing bolt utilizes the through-hole already present in the external conductive terminal, thereby merging two functions (electrical connection and mechanical fastening) into a single structural element.
Solution Approach 2:
The patent extracts the fixing function from the resin frame structure and relocates it to the external conductive terminal. By moving the fixing hole requirement from the resin frame to the external conductive terminal, the design eliminates dead spaces in the resin frame while maintaining reliable cooler mounting through the external terminal's through-hole.
3Reliability
If the external conductive terminal is positioned away from the resin frame edge for electrical connection, then the electrical connection reliability is improved, but the device width increases due to spacing requirements
Solution Approach 1:
The patent merges the electrical connection function and mechanical fastening function into the same spatial location. The external conductive terminal's through-hole is positioned such that it serves both electrical conduction and mechanical fastening purposes, eliminating the need for separate spacing between electrical connection points and mechanical mounting points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for the downsizing of semiconductor devices by eliminating dead spaces, reducing the external form factor and saving materials, thereby achieving cost reduction and improved packaging efficiency.
Implementation Method 1
The external conductive terminal has a first through-hole and a second through-hole communicating with the first through-hole and disposed under the first through-hole. The cooler has a top plate having a third through-hole communicating with the second through-hole... The bolt has a head portion with a larger outer diameter than the first through-hole and a shaft portion extending from the head portion... The shaft portion is inserted through the first through-hole, the second through-hole, and the third through-hole and is screwed and tightened to the screw hole.
Data Source
AI summary
The present invention provides a semiconductor device that is reduced in size by changing the structure of a fixing portion used for fixing a semiconductor module to a cooler. Bolts 17 are inserted through first through-holes 4 of external conductive terminals 3, second through-holes 6 formed in a resin frame 5, and third through-holes 10 formed in a top plate 9, and the ends of the bolts 17 are screwed to resin nuts 16. External wiring 25, the external conductive terminals 3, a semiconductor module 1, and a cooler 2 are fastened by the bolts 17, thereby fixing the whole members.