Semiconductor Cooler Cover Layout for Low-Height Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor apparatuses with integrated semiconductor modules and coolers have a high height due to their configuration, making them difficult to install in spaces with limited height, and there is a risk of internal structure damage from external factors.
Innovation Solution
A semiconductor apparatus with a cooler featuring a bottom plate, fins, and a cover member that includes a fin cover and a plate cover, where the cover member has a heat dissipation area and an insulating substrate on its outer surface, and an insulating member seals the substrate and semiconductor element, reducing the overall height by positioning the plate cover surface closer to the bottom plate than the heat dissipation outer surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor apparatus uses a case member disposed on the top plate of the cooler to enclose and seal the internal structure, then the internal structure is protected from external damage, but the height of the apparatus increases making it difficult to install in low-height spaces
Solution Approach 1:
The patent merges the protective case member function with the heat dissipation cover member into a single integrated component. The cover member simultaneously serves as both the protective enclosure and the heat dissipation surface, eliminating the need for separate case member and reducing overall apparatus height while maintaining protection of internal structures
Solution Approach 2:
The cover member is designed to perform multiple functions: it acts as a protective enclosure for internal components, provides heat dissipation through its heat dissipation outer surface for mounting semiconductor elements, and serves as the sealing structure. This multi-functionality reduces the number of components and overall height
2Temperature
If the cover member is positioned higher to provide adequate heat dissipation surface area, then heat dissipation effectiveness is improved, but the apparatus height increases
Solution Approach 1:
The patent extends the heat dissipation function into the horizontal plane rather than requiring vertical height. The cover member has a large planar area that extends laterally, providing sufficient heat dissipation surface area while maintaining a compact height profile by utilizing horizontal space instead of vertical space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for a reduced height of the semiconductor apparatus, enhancing installation flexibility in low-height spaces while maintaining effective heat dissipation and protecting internal components.
Implementation Method 1
Heat caused by an operation of the semiconductor module is dissipated through a coolant that circulates within the cooler
Implementation Method 2
the fin cover member having a heat dissipation flat area having a heat dissipation inner surface and a heat dissipation outer surface
Data Source
AI summary
A semiconductor apparatus includes a cooler including a bottom plate, a plurality of fins disposed on the bottom plate, and a cover member including a fin cover member and a plate cover member. The fin cover member covers the plurality of fins and has a heat dissipation outer surface. The plate cover member surrounds an outer periphery of the fin cover member, is disposed on the bottom plate, and has a plate cover surface. The apparatus further includes an insulating substrate on the heat dissipation outer surface, a semiconductor element on the insulating substrate, and an insulating member on the plate cover surface, to seal the insulating substrate and the semiconductor element. The plate cover surface is position closer to the bottom plate than is the heat dissipation outer surface with respect to a height direction orthogonal to the bottom plate.