Semiconductor Module Cooler Uniform Flow Diffusion Wall
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor module coolers, the flow rate of the cooling medium is higher at the center than at the periphery, leading to uneven cooling of semiconductor elements, which limits output current and efficiency due to temperature differences among elements.
Innovation Solution
A semiconductor module cooler design with a cooling medium jacket featuring a cooling fin cooling room, a diffusion room, a diffusion wall, and a convergence room, where the cooling medium is introduced, diffused, and converged to ensure uniform flow and cooling across the cooling fins, allowing semiconductor elements to be arranged in a direction intersecting the flow for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cooling medium flows through the cooling passage surrounded by wide cooling passage side walls, then the cooling medium can cool the heat dissipation fins, but the flow rate becomes higher at the center than at the periphery, causing uneven cooling of semiconductor elements
Solution Approach 1:
The cooling passage is divided into multiple sub-passages by partition walls, with each sub-passage containing a specific number of heat dissipation fins. This segmentation ensures that the cooling medium is distributed more uniformly across the width direction, reducing the flow rate difference between center and periphery regions, and achieving more uniform cooling of semiconductor elements arranged in directions intersecting the flow direction.
Solution Approach 2:
Different regions of the cooling passage are designed with different characteristics - the partition walls create localized flow channels that adjust the cooling medium distribution according to the specific cooling needs of different semiconductor element positions, ensuring optimal cooling uniformity across the entire array.
2Temperature
If semiconductor elements are arranged in a direction intersecting the flow direction of cooling medium, then uniform cooling can be achieved, but the device complexity increases due to the need for specific cooling passage design
Solution Approach 1:
The cooling passage is segmented into multiple sub-passages using simple partition walls, which can be integrated into the heat sink structure during manufacturing. This approach achieves uniform cooling distribution without requiring complex external cooling systems, thus reducing overall device complexity while maintaining temperature uniformity.
Solution Approach 2:
The cooling passage structure is merged with the heat sink structure, integrating the cooling function into the existing thermal management component. This combination eliminates the need for separate complex cooling systems and simplifies the overall device architecture while achieving the desired uniform cooling effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures uniform cooling of semiconductor elements, reducing temperature differences and enabling sufficient output current by ensuring a consistent flow of the cooling medium across the cooling fins, thereby enhancing the cooling efficiency and performance.
Implementation Method 1
a cooling medium flows between the heat dissipation fins to dissipate heat generated from the semiconductor elements
Implementation Method 2
heat dissipation fins are integrally formed on a rear surface of a heat sink to which an insulating substrate having a plurality of semiconductor elements arranged thereon is bonded
Data Source
Figure 1(a)~1(d)
Figure 2
Figure 3
AI summary
Provided is a semiconductor module cooler capable of effectively cooling a semiconductor element. The semiconductor module cooler supplies a cooling medium to a cooling medium jacket (2) from the outside and cools a semiconductor element (13) which is provided on the outer surface of a heat sink (1) including fins (11). In the cooler, the cooling medium introduced from the outside is diffused in a cooling medium diffusion room (26), flows over a cooling medium diffusion wall (25), is introduced into a cooling fin cooling room (28) in which the fins (11) are arranged, cools the fins (11), and is discharged from a cooling medium discharge port (21) to the outside.