Semiconductor Cooler Assembly With Engagement-Piece Positioning
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Solution Overview
Problem
Conventional semiconductor apparatuses require complex configurations for accurately positioning the heat dissipation board with respect to the cooling case, involving additional components for alignment.
Innovation Solution
The semiconductor apparatus incorporates a heat dissipation board with engagement pieces that engage the inner wall surface of the cooling case's recess, allowing precise positioning without additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If additional positioning components are provided on both the cooling case and cooling fin base, then the heat dissipation board can be positioned accurately with reference to the cooling case, but the device complexity increases due to complicated parts
Solution Approach 1:
The invention extracts the positioning function from the cooling case and concentrates it entirely on the heat dissipation board through engagement pieces. This eliminates the need for corresponding positioning components on the cooling case, reducing overall parts complexity while maintaining positioning accuracy.
Solution Approach 2:
The engagement pieces on the heat dissipation board serve dual functions: they provide positioning accuracy during assembly and also act as structural connection elements between the heat dissipation board and cooling case, eliminating the need for separate positioning components.
2Device complexity
If engagement pieces are provided only on the heat dissipation board, then the device complexity is reduced, but the positioning accuracy may be compromised
Solution Approach 1:
The engagement pieces are strategically positioned at specific locations on the heat dissipation board where they engage with corresponding features on the cooling case. This localized positioning approach ensures accurate alignment and placement while maintaining a simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurate positioning of the heat dissipation board is achieved without complicating the configuration, maintaining efficient cooling medium flow and preventing misalignment.
Implementation Method 1
Causing a cooling medium having a pressure applied thereto by an external pump to flow through a flow passage within the cooling case releases the heat generation energy of the power semiconductor element into the cooling medium via the fins
Implementation Method 2
flow through a flow passage within the cooling case releases the heat generation energy
Implementation Method 3
the heat dissipation surface is provided with a plurality of engagement pieces for positioning that engage portions of an inner wall surface in the recess of the cooling case
Data Source
AI summary
A semiconductor apparatus, including an insulated substrate having a first surface and a second surface that are opposite to each other, a semiconductor element that is mounted on the first surface of the insulated substrate, and a cooler for cooling the semiconductor element. The cooler includes a heat dissipation board having a bonding surface and a heat dissipation surface that are opposite to each other, the bonding surface being bonded to the second surface of the insulated substrate, a plurality of fins provided on the heat dissipation surface of the heat dissipation board, and a cooling case having a recess accommodating the plurality of fins, an inner wall surface of the cooling case being in the recess. The heat dissipation surface is provided with a plurality of engagement pieces that position the cooling case by engaging portions of the inner wall surface of the cooling case.