Semiconductor Cooler With Flexible Heat Dissipator Contact
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Solution Overview
Problem
Existing coolers for semiconductor devices suffer from insufficient cooling due to gaps between the radiator and housing, leading to inefficient heat dissipation.
Innovation Solution
A cooler design featuring a housing with recesses and a flexible bottom part that deforms elastically, allowing the heat dissipator to be pressed against the semiconductor device, ensuring direct contact with cooling water and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a gap exists between the radiator and housing in the hollow region, then the structure is easier to manufacture, but the cooling water concentrates in the gap resulting in insufficient cooling of the radiator and semiconductor device
Solution Approach 1:
The patent employs a flexible radiator that can deform to eliminate gaps between the radiator and housing. The radiator includes a body portion and a peripheral portion that elastically deforms to contact the housing inner surface, ensuring uniform heat dissipation and preventing cooling water concentration in gaps.
Solution Approach 2:
The radiator is designed with dynamic flexibility, allowing it to adapt its shape based on mounting conditions. The peripheral portion can elastically deform to maintain intimate contact with the housing, transforming from a rigid structure to a dynamically adaptable one that optimizes cooling performance.
2Device complexity
If the semiconductor device is cooled indirectly via the radiator, then the structure is simpler, but the cooling efficiency is insufficient compared to direct cooling
Solution Approach 1:
The patent replaces the indirect thermal conduction mechanism with direct liquid cooling contact. By ensuring the radiator peripheral portion tightly contacts the housing, cooling water flows directly over the semiconductor device surface, substituting inefficient thermal conduction through the radiator with efficient convective cooling.
Solution Approach 2:
The invention changes the thermal transfer parameter from indirect conduction to direct liquid contact. The flexible radiator design enables cooling water to directly touch the semiconductor device, fundamentally altering the heat transfer mechanism and dramatically improving cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by ensuring uniform contact between cooling water and the heat dissipator, effectively addressing the issue of insufficient cooling in existing designs.
Implementation Method 1
the bottom part includes a flexible portion that deforms elastically, and when a load toward the second side in the first direction is applied to the heat dissipator, an elastic force toward the first side in the first direction, which is generated from the flexible portion, acts on the heat dissipator
Implementation Method 2
ensuring direct contact with cooling water and improved thermal conductivity
Data Source
AI summary
A cooler includes a housing and a heat dissipator. The housing includes a recess that opens on a first side in a first direction and a bottom part located on a second side in the first direction and defining a part of the recess. The heat dissipator is attached to the bottom part and at least partially housed in the recess. The bottom part includes a flexible portion that deforms elastically. When a load toward the second side in the first direction is applied to the heat dissipator, an elastic force toward the first side in the first direction, which is generated from the flexible portion, acts on the heat dissipator. A semiconductor module includes a cooler, a semiconductor device disposed on the cooler, and a mounting member that holds the semiconductor device on the cooler.