Semiconductor Module Cooler with Parallel Flow Channels
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Solution Overview
Problem
Conventional semiconductor module coolers face challenges in achieving uniform and stable cooling performance due to disproportionate coolant flow distribution, leading to increased temperature and reduced device life, particularly in high-power semiconductor devices.
Innovation Solution
A semiconductor module cooler design featuring a heat sink with a first flow channel, a second flow channel parallel to the first, and a third flow channel connecting them, where the coolant inlet and outlet are on the same wall surface, and fins are arranged with equal intervals in the third flow channel, with a guide section to adjust flow velocity and reduce pressure loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If coolant flow rate is increased to enhance cooling efficiency, then cooling performance is improved, but pressure loss of coolant increases significantly
Solution Approach 1:
The flow channel is divided into multiple parallel channels (first flow channel, second flow channel, and third flow channel) to segment the coolant flow. This segmentation allows coolant to flow through multiple paths simultaneously, reducing pressure loss while maintaining effective cooling coverage across the semiconductor device.
Solution Approach 2:
The patent introduces a guide section with an inclined surface in the first flow channel to locally modify flow characteristics. This guide section directs coolant flow toward the heat sink, ensuring optimal coolant distribution in critical cooling regions while maintaining lower overall pressure loss through the parallel channel structure.
2Area of stationary object
If a serpentine flow channel is used to connect multiple flow channels in series, then cooling coverage is expanded, but pressure loss increases significantly
Solution Approach 1:
Instead of using a single serpentine channel that winds through the entire cooling area, the patent segments the cooling path into multiple parallel channels. Each channel covers a specific portion of the semiconductor device, and all channels are connected in parallel between common inlet and outlet, eliminating the long serpentine path that causes high pressure loss.
Solution Approach 2:
The patent transitions from a one-dimensional serpentine flow path to a multi-dimensional parallel channel arrangement. By organizing channels in parallel across multiple spatial dimensions, the system achieves extensive cooling coverage without the pressure loss penalty of a long winding single-channel path.
3Temperature
If heat sinks are arranged with high heat transfer rate to enhance cooling efficiency, then cooling performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the coolant flow channels with the heat sink structure by forming the flow channels directly within the water jacket that surrounds the heat sink. This integration eliminates the need for separate, complex channel components and reduces overall apparatus complexity while maintaining high heat transfer efficiency.
Solution Approach 2:
The water jacket serves multiple functions simultaneously: it acts as a coolant containment structure, provides thermal conduction paths, and forms the flow channels for coolant circulation. This multi-functionality reduces the number of separate components needed, simplifying the overall apparatus while enhancing cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively addresses the disproportionate flow distribution, ensuring stable and uniform cooling performance across the semiconductor device, reducing temperature variations and preventing malfunction or destruction from heat generation.
Implementation Method 1
a heat sink (2C) thermally connected to the semiconductor device (3)
Implementation Method 2
a first flow channel (21) extending from a coolant inlet and arranged inside the water jacket
Data Source
AI summary
A semiconductor module cooler supplies a coolant to a water jacket from outside and cools a semiconductor device arranged on an outer surface of the cooler. The semiconductor module cooler has a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel arranged inside the water jacket in parallel to the first flow channel and extending to a coolant outlet; and a third flow channel formed inside the water jacket at a position connecting the first flow channel and the second flow channel. The coolant inlet and the coolant outlet are formed on a same wall surface of the water jacket, and the heat sink is arranged in the third flow channel.