Semiconductor Cooler Flow Path Layout for Compact Heat Transfer
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Solution Overview
Problem
Existing semiconductor apparatuses face challenges in reducing the size of the cooler due to inefficient refrigerant flow paths and heat transfer mechanisms, leading to increased size and reduced cooling efficiency.
Innovation Solution
The cooler design incorporates a cooling main body with a first and second flow path and an array of cooling flow paths that intersect perpendicularly, allowing for efficient refrigerant flow and improved heat transfer by positioning the flow paths between the inflow and outflow paths, reducing the need for additional header structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If conventional cooler design with separate header structures is used, then refrigerant flow paths are established, but the cooler size increases and cooling efficiency decreases
Solution Approach 1:
The patent merges the header structure with the cooling flow paths by forming the flow paths directly within the cooling main body. The first and second flow paths are integrated into the cooling wall structure, eliminating the need for separate header components. This integration reduces the overall cooler volume while maintaining effective refrigerant distribution to all cooling flow paths, thereby improving cooling efficiency without increasing size.
Solution Approach 2:
The patent transitions from a conventional two-dimensional flow path arrangement to a three-dimensional integrated structure. The cooling flow paths are positioned between the first and second flow paths in the third direction (perpendicular to the cooling wall surface), creating a layered three-dimensional configuration. This spatial arrangement allows efficient heat transfer from the heat generator while minimizing the cooler's footprint and reducing temperature differences across the refrigerant flow paths.
2Strength
If cooling flow paths are positioned away from heat generator, then structural stability is improved, but heat transfer efficiency decreases
Solution Approach 1:
The patent applies local quality by positioning the cooling flow paths at specific locations within the cooling main body. The flow paths are arranged between the first and second flow paths in the third direction, with each cooling flow path having its wall surface forming part of the cooling wall. This strategic positioning optimizes the distance between the heat generator and cooling flow paths for each local region, ensuring efficient heat transfer while maintaining overall structural stability of the cooling apparatus.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall size of the cooler and enhances cooling efficiency by minimizing temperature differences within the refrigerant flow paths, thereby improving the cooling performance and reducing interference with terminal connections.
Implementation Method 1
a heat generator, and a cooler that cool the heat generator. The heat generator is cooled by the cooler that uses a refrigerant
Implementation Method 2
a first flow path extending in the first direction, and having an end into which a refrigerant flows; a second flow path extending in the first direction, and having an end from which the refrigerant flows out
Data Source
AI summary
A cooler includes a main body extending in the Y direction. The main body includes: (i) an outer wall including an outer surface on which a semiconductor module is to be arranged, and an inner surface; (ii) an inflow path extending in the Y direction, and having an end into which a refrigerant flows; (iii) an outflow path extending in the Y direction, and having an end from which the refrigerant flows out; and (iv) cooling flow paths having the inner surface as a part of a wall surface. The cooling flow paths are arrayed in the Y direction, extend in the X direction, and are positioned between the inflow and outflow paths and the outer wall in the Z direction. Each of the cooling flow paths causes the inflow path and the outflow path to communicate with each other in the X direction.