Semiconductor Cooler Fixation via Internal Flow Paths

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing semiconductor devices face issues with space efficiency, size increase due to tabs, and the need for sealing gaps when using bolts to fix coolers, which complicates the cooling process and increases complexity.

Innovation Solution

The semiconductor device employs a design where bolts are accommodated within second flow paths, eliminating the need for tabs and bolt holes, and using bolt-head retainers and internally threaded portions to fix coolers, allowing for efficient cooling without additional sealing requirements, and optionally incorporating compressed springs to maintain pressure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If tabs are provided at both ends of coolers to enable bolting, then coolers can be fixed together, but the device size increases

Engineering Contradiction:
Improvefixation of coolersVSAvoiddevice size
Core Design Contradiction:
Stability of the object's compositionVSArea of stationary object

Solution Approach 1:

The patent merges the tab structure with the cooler body by providing protrusions directly on the cooler surfaces that serve as bolting features. This eliminates separate tabs, allowing coolers to be fixed together without increasing the overall device envelope dimensions.

Inventive Principle:
Principle #5Merging (Combining)

2Stability of the object's composition

If bolt holes are provided in coolers for bolt penetration, then coolers can be fixed together, but sealing gaps requires additional gaskets or O rings

Engineering Contradiction:
Improvefixation of coolersVSAvoidsealing requirements
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent extracts the bolting function from the cooler body by providing protrusions that extend from the cooler surfaces. Bolts engage these protrusions without penetrating the cooler material, thereby eliminating the need for bolt holes and the associated sealing complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

3Temperature

If compressed spring is inserted to press semiconductor device, then cooling efficiency is improved, but space for disposing the spring is required

Engineering Contradiction:
Improvecooling efficiencyVSAvoidspace for spring
Core Design Contradiction:
TemperatureVSVolume of stationary object

Solution Approach 1:

The patent merges the pressing function into the bolting system itself. The bolts, when tightened, directly apply compressive force between the coolers and semiconductor modules, eliminating the need for separate spring elements and their associated space requirements.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances cooling efficiency by ensuring direct contact between semiconductor modules and coolers, improves space efficiency, and simplifies the fixation process by eliminating the need for tabs and sealing gaps, while maintaining pressure even when bolts are loosened.

Implementation Method 1

Each of the semiconductor modules is cooled from its both sides by a coolant flowing in the corresponding pair of the coolers

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The semiconductor device in Patent Literature 1 has a compressed spring inserted between a casing and a stack of the coolers and the semiconductor modules, and is pressed by a force of the compressed spring in the stacking direction

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

The coolers and the semiconductor modules are pressed against each other by a fastening load of the bolts

Methodology Applied
Scientific EffectMechanical force: Mechanical Force

Data Source

PatentUS10777485B2Semiconductor device
Publication Date: 2020.09.15 TOYOTA JIDOSHA KK
  • US10777485B2 patent drawing
  • US10777485B2 patent drawing
  • US10777485B2 patent drawing

AI summary

A semiconductor device may include coolers, semiconductor modules, and a pair of connecting pipes. The coolers are arranged in a line and each of which includes a first flow path. Each of the semiconductor modules is interposed between a corresponding pair of the coolers. Each of the connecting pipes communicates with the adjacent coolers. A pair of coolant holes may be provided at one of the coolers located at one end in the stacking direction. A pair of second flow paths may extend respectively from the coolant holes to one of the coolers located at other end in the stacking direction. A bolt-head retainer and an internally threaded portion may be provided in each second flow path, the bolt-head retainer retaining a head of a bolt, and the internally threaded portion fixing the bolt. The coolers between the bolt-lead retainers and the internally threaded portions are fixed by the bolts.