Semiconductor Cooler Flow Path Layout for Gas Separation

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Solution Overview

Problem

The presence of gas in the refrigerant flow path of coolers for semiconductor devices reduces cooling efficiency due to gas remaining in contact with cooling walls, leading to decreased performance.

Innovation Solution

A cooler design featuring a cooling body with partitioned flow paths and gas-retaining spaces that prevent gas from entering cooling paths, using protrusions to direct gas into separate compartments, thereby maintaining efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If gas is produced in the refrigerant or enters the refrigerant due to boiling, then the refrigerant can cool the heat generator, but gas remains in the flow path and contacts the cooling wall, reducing cooling efficiency

Engineering Contradiction:
Improvecooling efficiencyVSAvoidgas accumulation in flow path
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The flow path is divided into multiple segments: a first flow path for refrigerant supply, a second flow path for refrigerant drainage, and multiple cooling paths for heat exchange. Partitions separate these paths, ensuring gas is directed to the drainage path while refrigerant flows through the cooling paths, preventing gas accumulation on cooling walls.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Gas is extracted from the main cooling flow path and directed to a separate drainage flow path. The partition structure creates a gas-retaining space that captures gas bubbles and directs them to the second flow path, removing the harmful gas phase from the heat exchange process.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If partitions are added to separate flow paths, then gas can be prevented from entering cooling paths, but the device structure becomes more complex

Engineering Contradiction:
Improveprevention of gas contact with cooling wallVSAvoidpartition structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The partitions serve multiple functions simultaneously: they separate the first flow path from cooling paths, separate the second flow path from cooling paths, define gas-retaining spaces, and guide gas flow. This multi-functionality reduces the need for additional components despite the increased structural organization.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Use of energy by moving object

If cooling paths are arranged between the first flow path and the cooling wall, then heat transfer efficiency is improved, but gas may still contact the cooling wall and reduce performance

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidgas contact with cooling wall
Core Design Contradiction:
Use of energy by moving objectVSObject-generated harmful factors

Solution Approach 1:

Different regions of the flow path system have different functions: the first flow path region handles refrigerant supply, the cooling path regions handle heat exchange, the second flow path region handles gas and refrigerant drainage, and the gas-retaining space handles gas accumulation. This localized functional assignment ensures gas is kept away from cooling walls while maintaining efficient heat transfer in the cooling paths.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents gas from contacting cooling walls, maintaining cooling efficiency by ensuring gas is contained in separate spaces, thus enhancing the overall performance of the cooler.

Implementation Method 1

a cooling wall including a first surface on which a heat generator is arranged, and a second surface opposite to the first surface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a plurality of cooling paths each having a wall surface, a part of the wall surface being constituted by the second surface

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12550293B2Cooler and semiconductor device
Publication Date: 2026.02.10 FUJI ELECTRIC CO LTD
  • US12550293B2 patent drawing
  • US12550293B2 patent drawing
  • US12550293B2 patent drawing

AI summary

A cooler includes: a cooling wall including a first surface and a second surface; a first path extending in a first direction and having an inlet for a refrigerant; a second path extending in the first direction and having an outlet for the refrigerant; a cooling path causing the first path to communicate with the second path in a second direction intersecting the first direction; a partition spaced from the cooling wall in a third direction perpendicular to the first surface, separating the first and second paths from the cooling paths, and including a third surface constituting a part of a wall surface of the first path, the third surface including a first portion and a second portion differing from the first portion in position in the third direction. The first path includes a first gas retaining space defined by the first and second portions.