Semiconductor Cooler with Orthogonal Heat Sink Channels
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Solution Overview
Problem
Conventional semiconductor-module coolers face challenges with high manufacturing costs, weight, and stability due to complex assembly processes and heavy cooling devices, particularly with the positioning accuracy of flow rate control plates and increased pressure loss in coolant systems.
Innovation Solution
A method for manufacturing a semiconductor-module cooler with a cuboid heat sink, a thermal radiation plate, and a tray-shaped cooling jacket, where a flow rate control plate is fixed to the heat sink, and the heat sink is arranged within the cooling jacket such that the flow rate control plate extends between the coolant extraction and cooling channels, with channels on the heat sink orthogonal to the coolant introduction and extraction channels, and the thermal radiation plate is bonded to close the cooling jacket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the flow rate of the coolant is increased to improve cooling efficiency, then the cooling performance is improved, but the pressure loss of the coolant increases, thus increasing the load on the cooling pump
Solution Approach 1:
The cooling device is divided into multiple cooling channels arranged in parallel between the coolant introduction and extraction channels. This segmentation allows the coolant flow to be distributed across multiple paths, reducing the flow rate required in each individual channel while maintaining overall cooling efficiency, thereby decreasing pressure loss and pump load.
2Temperature
If a complex fin shape providing high heat transfer rate is employed, then the heat transfer coefficient is improved, but the pressure loss of the coolant increases
Solution Approach 1:
The fin shapes are optimized locally within each cooling channel to provide effective heat transfer from the semiconductor devices to the coolant, while the overall channel configuration maintains smooth coolant flow paths. This local optimization of heat transfer surfaces without compromising flow characteristics reduces pressure loss while maintaining high heat transfer coefficients.
3Temperature
If fins made of higher thermal conductivity material are employed, then the heat transfer rate is improved, but the entire cost of the cooling device increases
Solution Approach 1:
Instead of changing the material parameter (thermal conductivity) to improve heat transfer, the invention changes the geometric parameters of the cooling channels and fin structures. By optimizing channel dimensions, fin spacing, and surface areas, the patent achieves high heat transfer rates using cost-effective materials, thereby reducing manufacturing costs while maintaining thermal performance.
4Area of stationary object
If multiple cooling channels are connected in series to cool multiple semiconductor devices, then the cooling coverage is improved, but the pressure loss is predominantly increased
Solution Approach 1:
Multiple cooling channels are arranged in parallel rather than in series, segmenting the coolant flow path into multiple independent channels. This allows the coolant to flow through all channels simultaneously at reduced flow rates, providing comprehensive cooling coverage across multiple semiconductor devices while minimizing pressure loss and pump load requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, provides stable cooling performance, and results in a lightweight, robust cooler with enhanced heat radiation capabilities, making it suitable for electrically-driven vehicles.
Implementation Method 1
a cooling device that uses a plurality of heat sinks to cool a number of power semiconductor devices
Implementation Method 2
liquid-cooled devices have been used... a scheme of increasing the flow rate of the coolant to improve the cooling efficiency
Implementation Method 3
a thermal radiation plate on the outer surface of which a semiconductor device is bonded
Data Source
AI summary
A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.